@inproceedings{TUW-209875, author = {Orio, Roberto and Ceric, Hajdin and Selberherr, Siegfried}, title = {{M}odeling of {E}lectromigration {I}nduced {R}esistance {C}hange in {T}hree-{D}imensional {I}nterconnects with {T}hrough {S}ilicon {V}ias}, booktitle = {{P}roceedings of the {I}nternational {C}onference on {S}imulation of {S}emiconductor {P}rocesses and {D}evices ({S}{I}{S}{P}{A}{D})}, year = {2012}, pages = {268--271}, url = {http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2012_Orio_1.pdf}, isbn = {978-0-615-71756-2}, note = {talk: {I}nternational {C}onference on {S}imulation of {S}emiconductor {P}rocesses and {D}evices ({S}{I}{S}{P}{A}{D}), {D}enver, {C}{O}, {U}{S}{A}; 2012-09-05 -- 2012-09-07} }