[Zurück]

S.G. Serra, A. Schneider, K. Malecki, S.E. Huq, W. Brenner:
"A simple bonding process of SU-8 to glass to seal a microfluidic device";
Vortrag: 4M 2007 - Third International conference on multi-material micro manufacture, Borovets, Bulgaria (eingeladen); 03.10.2007 - 05.10.2007; in: "4M 2007 - Third international Conference on multi-material micro manufacture - Proceedings", (2007), ISBN: 978-1904445-53-1; S. 43 - 46.

This paper describes a simple process of adhesive bonding between a glass lid and a SU-8 microfluidic device. The bonding is made by applying pressure, between 1.24 MPa - 3.72 MPa, and heat above the SU-8 glass transition temperature (Tg). The advantages of this process are low cost, simplicity and no need of extra adhesive material, which
could block microchannels and inlets. The SU-8 microchannels are fabricated on a glass substrate by UV photolithography. The resist thickness is 30 μm and the smallest channels are 5 μm in width. The bonding process was performed using a simple uniaxial press, a torque wrench and a convection oven as an alternative to the complex and
expensive bonding machines with a vacuum chamber and alignment tools. To identify a suitable bonding temperature, a Tg of 175°C for the patterned SU-8 was obtained by Dynamic Mechanical Analysis (DMA). The bonding strength was 1.15MPa, measured by a pull-out test, and a bonding area of 90% was achieved, which was observed by visual
inspection. It was also investigated the effect of an O2 plasma cleaning process on the bonding quality.

Projektleitung Werner Brenner:
Methoden und Werkzeuge für Handhabung und Montage in der Mikrodimension (Tech. abgeschlossen 2007)