R. Orio, H. Ceric, S. Selberherr:
"Effect of Strains on Anisotropic Material Transport in Copper Interconnect Structures under Electromigration Stress";
Journal of Computational Electronics, 7 (2008), 3; S. 128 - 131.
http://dx.doi.org/10.1007/s10825-008-0211-9Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2008/JB2008_Orio_1.pdf