H. Ceric, S. Selberherr:
"Editorial Preface to the Special Section on Electromigration Published in March 2009";
IEEE Transactions on Device and Materials Reliability, 9 (2009), 2; S. 103.
http://dx.doi.org/10.1109/TDMR.2009.2020086Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2009/JB2009_Ceric_2.pdf