S. E. Tyaginov, V. Sverdlov, I. Starkov, W. Gös, T. Grasser:
"Impact of O-Si-O Bond Angle Fluctuations on the Si-O Bond-Breakage Rate";
Microelectronics Reliability, 49 (2009), S. 998 - 1002.
http://dx.doi.org/10.1016/j.microrel.2009.06.018Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2009/JB2009_Tyaginov_2.pdf