H. Ceric, S. Selberherr:
"Electromigration in Submicron Interconnect Features of Integrated Circuits";
Materials Science and Engineering R-Reports, 71 (2011), 5-6; S. 53 - 86.
http://dx.doi.org/10.1016/j.mser.2010.09.001Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2010/Ceric_Selberherr.PDF