R. Orio, H. Ceric, S. Selberherr:
"A Compact Model for Early Electromigration Failures of Copper Dual-Damascene Interconnects";
Microelectronics Reliability, 51 (2011), S. 1573 - 1577.
http://dx.doi.org/10.1016/j.microrel.2011.07.049Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2011/JB2011_Orio_1.pdf