L. Filipovic, S. Selberherr:
"The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias";
Microelectronics Reliability, 54 (2014), 9-10; S. 1953 - 1958.
http://dx.doi.org/10.1016/j.microrel.2014.07.014Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2014_Filipovic_3.pdf