L. Filipovic:
"A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration";
Microelectronics Reliability, 97 (2019), S. 38 - 52.
http://dx.doi.org/10.1016/j.microrel.2019.04.005Elektronische Version der Publikation:
http://www.iue.tuwien.ac.at/pdf/ib_2019/JB2019_Filipovic_1.pdf