Contributions to Books:
L.F. Aguinsky, G. Wachter, F. Rodrigues, A. Scharinger, A. Toifl, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si";
in: "Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)",
B. Cretu (ed.);
IEEE,
2021,
1
- 4.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/EuroSOI-ULIS53016.2021.9560685
Electronic version of the publication:
https://www.iue.tuwien.ac.at/pdf/ib_2021/BC2021_Aguinsky_1.pdf