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@inproceedings{TUW-209875,
    author = {Orio, Roberto and Ceric, Hajdin and Selberherr, Siegfried},
    title = {{M}odeling of {E}lectromigration {I}nduced {R}esistance {C}hange in {T}hree-{D}imensional {I}nterconnects with {T}hrough {S}ilicon {V}ias},
    booktitle = {{P}roceedings of the 17th {I}nternational {C}onference on {S}imulation of {S}emiconductor {P}rocesses and {D}evices ({S}{I}{S}{P}{A}{D})},
    year = {2012},
    pages = {268--271},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2012/CP2012_Orio_1.pdf},
    isbn = {978-0-615-71756-2},
    note = {talk: {I}nternational {C}onference on {S}imulation of {S}emiconductor {P}rocesses and {D}evices ({S}{I}{S}{P}{A}{D}), {D}enver, {C}{O}, {U}{S}{A}; 2012-09-05 -- 2012-09-07}
}



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