[Zurück]

@inproceedings{TUW-230036,
    author = {Zisser, Wolfhard and Ceric, Hajdin and Weinbub, Josef and Selberherr, Siegfried},
    title = {Electromigration Reliability of Open TSV Structures},
    booktitle = {Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits},
    year = {2014},
    pages = {317--320},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2013/CP2014_Zisser_3.pdf},
    isbn = {978-1-4799-3931-2},
    doi = {10.1109/IPFA.2014.6898179},
    note = {Vortrag: International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Singapore; 2014-06-30 -- 2014-07-04}
}



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