[Zurück]

@inproceedings{TUW-231509,
    author = {Ceric, Hajdin and Zisser, Wolfhard and Rovitto, Marco and Selberherr, Siegfried},
    title = {Electromigration in Solder Bumps: A Mean-Time-to-Failure TCAD Study},
    booktitle = {Proceedings of the 19th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},
    year = {2014},
    pages = {221--224},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2014_Ceric_1.pdf},
    isbn = {978-1-4799-5285-4},
    doi = {10.1109/SISPAD.2014.6931603},
    note = {Posterpr{\"a}sentation: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 -- 2014-09-11}
}



Erstellt aus der Publikationsdatenbank der Technischen Universitšt Wien.