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@article{TUW-231553,
    author = {Filipovic, Lado and Selberherr, Siegfried},
    title = {{T}he {E}ffects of {E}tching and {D}eposition on the {P}erformance and {S}tress {E}volution of {O}pen {T}hrough {S}ilicon {V}ias},
    journal = {{M}icroelectronics {R}eliability},
    year = {2014},
    volume = {54},
    number = {9-10},
    pages = {1953--1958},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2014_Filipovic_3.pdf},
    doi = {10.1016/j.microrel.2014.07.014}
}