[Zurück]

@article{TUW-231579,
    author = {Zisser, Wolfhard and Ceric, Hajdin and Weinbub, Josef and Selberherr, Siegfried},
    title = {Electromigration Reliability of Open TSV Structures},
    journal = {Microelectronics Reliability},
    year = {2014},
    volume = {54},
    number = {9-10},
    pages = {2133--2137},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2014/JB2014_Zisser_1.pdf},
    doi = {10.1016/j.microrel.2014.07.099}
}



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