[Zurück]

@inproceedings{TUW-238800,
    author = {Rovitto, Marco and Zisser, Wolfhard and Ceric, Hajdin and Grasser, Tibor},
    title = {Electromigration Modelling of Void Nucleation in Open Cu-TSVs},
    booktitle = {Proceedings of the IEEE 16th International Conference on Thermal, Mechanical {\&} Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
    year = {2015},
    publisher = {IEEE Xplore},
    numpages = {5},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2015_Rovitto_1.pdf},
    isbn = {978-1-4799-9949-1},
    doi = {10.1109/EuroSimE.2015.7103100},
    note = {Posterpr{\"a}sentation: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Budapest, Hungary; 2015-04-19 -- 2015-04-22}
}



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