[Zurück]

@inproceedings{TUW-239722,
    author = {Rovitto, Marco and Zisser, Wolfhard and Ceric, Hajdin},
    title = {Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs},
    booktitle = {Proceedings of the IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)},
    year = {2015},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2014/CP2015_Rovitto_2.pdf},
    note = {Posterpr{\"a}sentation: International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Hsinchu, Taiwan; 2015-06-29 -- 2015-07-02}
}



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