[Zurück]

@inproceedings{TUW-240760,
    author = {Papaleo, Santo and Zisser, Wolfhard and Ceric, Hajdin},
    title = {Factors that Influence Delamination at the Bottom of Open TSVs},
    booktitle = {Proceedings of the 20\textsuperscript{th} International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)},
    year = {2015},
    pages = {421--424},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2015/CP2015_Papaleo_1.pdf},
    isbn = {978-1-4673-7858-1},
    doi = {10.1109/SISPAD.2015.7292350},
    note = {Posterpr{\"a}sentation: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Washington DC, USA; 2015-09-09 -- 2015-09-11}
}



Erstellt aus der Publikationsdatenbank der Technischen Universitšt Wien.