[Zurück]

@inproceedings{TUW-261148,
    author = {Filipovic, Lado and de Orio, R.L. and Zisser, Wolfhard and Selberherr, Siegfried},
    title = {Modeling Electromigration in Nanoscaled Copper Interconnects},
    booktitle = {Proceedings of the 22\textsuperscript{nd} International Conference on Simulation of Semiconductor Processes and Devices},
    year = {2017},
    pages = {161--164},
    url = {http://www.iue.tuwien.ac.at/pdf/ib_2017/CP2017_Filipovic_01.pdf},
    isbn = {978-4-86348-612-6},
    doi = {10.23919/SISPAD.2017.8085289},
    note = {Vortrag: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan; 2017-09-07 -- 2017-09-09}
}



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