Publikationsliste für
Johann Nicolics
als Autorin / Autor bzw. wesentlich beteiligte Person
433 Datensätze (1996 - 2021)
Die Publikationen der TU Wien sind erst ab dem Jahr 2002 vollzählig in der Publikationsdatenbank enthalten. Publikationen aus den Jahren vor 2002 können, müssen aber nicht in der Datenbank vorhanden sein.
Bücher und Buch-Herausgaben
E. Ceuca, M. Franz, J. Nicolics (Hrg.):
"Book of Abstracts - 36th International Spring Seminar on Electronics Technology - ISSE";
″1 Decembrie 1918″ University, Alba Iulia, Romania,
2013,
ISBN: 978-606-613-064-6;
238 S.
M. Franz, O. Krammer, J. Nicolics, H Wohlrabe (Hrg.):
"Proceedings of the 38th International Spring Seminar on Electronics Technology";
IEEE - Institute of Electrical and Electronics Engineers, Inc.,
2015,
ISBN: 978-1-4799-8860-0;
556 S.
M. Franz, J. Nicolics (Hrg.):
"35th International Spring Seminar on Electronics Technology (ISSE 2012). Book of Abstracts";
Institut für Sensor- und Aktuatorsysteme, Technische Universität Wien,
2012,
ISBN: 978-3-85465-015-7;
260 S.
M. Franz, J. Nicolics (Hrg.):
"Conference Proceedings: 34th International Spring Seminar on Electronics Technology-New Trends in Micro/Nanotechnology";
Institute of Electrical and Electronics Engineers, Inc.,
Red Hook, NY, USA,
2011,
ISBN: 978-1-4577-2112-0;
687 S.
M. Franz, J. Nicolics (Hrg.):
"Proceedings of the 2012 35th International Spring Seminar on Electronics Technology - Power Electronics";
IEEE - Institute of Electrical and Electronics Engineers, Inc.,
Red Hook, NY, USA,
2012,
ISBN: 978-1-4673-2240-9;
503 S.
M. Franz, J. Nicolics, E. Ceuca (Hrg.):
"Proceedings of the 2013 36th International Spring Seminar on Electronics Technology";
IEEE - Institute of Electrical and Electronics Engineers, Inc.,
2013,
ISBN: 978-1-4799-0036-7;
447 S.
M. Franz, J. Nicolics, H Wohlrabe (Hrg.):
"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology";
IEEE Xplore,
Red Hook, NY, USA,
2014,
ISBN: 978-1-4799-4455-2;
509 S.
G. Harsanyi, H Wohlrabe, M. Franz, O. Krammer, A. Geczy, I. Balazs, J. Nicolics (Hrg.):
"38th International Spring Seminar on Electronics Technology, Book of Abstracts";
Budapest University of Technology and Economics,
2015,
ISBN: 978-963-313-177-0;
250 S.
K. Malecha, O. Rac-Rumijowska, P. Markowski, H Wohlrabe, J. Nicolics, M. Unger (Hrg.):
"42th International Spring Seminar on Electronics Technology - ISSE 2019";
Oficyna Wydawnicza Politechniki Wrocławskiej,
2019,
ISBN: 978-83-7493-070-3;
205 S.
Zusätzliche Informationen
J. Nicolics (Hrg.):
"2010 33rd International Spring Seminar on Electronics Technology. Polymer Electronics and Nanotechnologies: Towards System Integration. Conference Proceedings.";
IEEE Press,
2010,
ISBN: 978-1-4244-7850-7;
565 S.
J. Nicolics (Hrg.):
"21st International Spring Seminar on Electronics Technology, Abstracts of ISSE'98";
Institut für Werkstoffe der Elektrotechnik,
Wien,
1998,
ISBN: 3-85465-004-3;
126 S.
J. Nicolics (Hrg.):
"43rd International Spring Seminar on Electronics Technology, ISSE 2020 - Conference Proceedings";
IEEE,
Curran Associates, Inc | 57 Morehouse Lane Red Hook | NY 12571 USA,
2020,
ISBN: 978-1-7281-6773-2;
446 S.
J. Nicolics (Hrg.):
"Conference Proceedings der 28th Int. Spring Seminar on Electronics Technology";
Institute of Sensors and Actuator Systems,
Wien,
2005,
ISBN: 0-7803-9325-2.
J. Nicolics (Hrg.):
"Proc. of XX. Chapter Poland ISHM Conference";
VTE,
1996,
347 S.
J. Nicolics, H. Hauser (Hrg.):
"28th International Spring Seminar on Electronics Technology";
ÖVE,
Wien, Austria,
2005,
ISBN: 3-85133-036-6.
J. Nicolics, H. Hauser (Hrg.):
"Book of Abstracts der 28th Int. Spring Seminar on Electronics Technology";
Institute of Sensors and Actuator Systems,
Wien,
2005.
Zusätzliche Informationen
J. Nicolics, L. Musiejovsky, H. Hauser (Hrg.):
"21st International Spring Seminar on Electronics Technology, Conference Proceedings of ISSE'98";
Institut für Werkstoffe der Elektrotechnik,
Wien,
1998,
ISBN: 3-85465-003-5;
300 S.
A. Pietrikova, M. Franz, J. Nicolics (Hrg.):
"Abstracs Proceedings:34th International Spring Seminar on Electronics Technology - New Trends in Micro/Nanotechnology";
ISSE 2011,
2011,
ISBN: 978-80-553-0646-9;
293 S.
A. Pietrikova, H Wohlrabe, J. Nicolics, M. Unger (Hrg.):
"43rd International Spring Seminar on Electronics Technology: "Trends in Microelectronics Packaging and Interconnection Technology" - Book of Extended Abstracts";
IEEE,
2020,
ISBN: 978-80-553-3529-2;
230 S.
H Wohlrabe, M. Franz, J. Nicolics (Hrg.):
"37th International Spring Seminar on Electronics Technology: Book of Abstracts";
Verlag Dr. Markus A. Detert,
Templin,
2014,
ISBN: 978-3-934142-49-7;
231 S.
Zeitschriftenartikel
G. Artner, P. K. Gentner, J. Nicolics, C. Mecklenbräuker:
"Carbon Fiber Reinforced Polymer with Shredded Fibers: Quasi-Isotropic Material Properties and Antenna Performance";
International Journal of Antennas and Propagation,
2017
(2017),
Article ID 6152651;
11 S.
Zusätzliche Informationen
I. Atassi, C. Atzlesberger, P.L. Fulmek, J. Nicolics, W. Smetana:
"Ferrofluid-Piston Based Micropump and Electromagnetic Actuation in LTCC Technology";
Journal of Microelectronics and Electronic Packaging,
6
(2009),
4;
S. 228
- 239.
Martin Brandl, J. Grabner, K.-H. Kellner, F. Seifert, J. Nicolics, S. Grabner, G. Grabner:
"A Low-Cost Wireless Sensor System and its Application in Dental Retainers";
IEEE Sensors Journal,
9
(2009),
3;
S. 255
- 262.
S. Cerimovic, A. Talic, R. Beigelbeck, H. Antlinger, T. Sauter, J. Nicolics, B. Jakoby, F. Keplinger:
"Bidirectional micromachined flow sensor featuring a hot film made of amorphous germanium";
Measurement Science & Technology,
24
(2013),
8;
S. 1
- 16.
Y. Didosyan, H. Hauser, W. Fiala, J. Nicolics, W. Toriser:
"Latching type optical switch";
Journal of Applied Physics,
91
(2002),
10;
S. 7000
- 7002.
Y. Didosyan, H. Hauser, J. Nicolics, F. Haberl:
"Application of Orthoferrites for Light Spot Position Measurements";
Journal of Applied Physics,
87
(2000),
S. 7079
- 7081.
Y. Didosyan, H. Hauser, J. Nicolics, I. Yavorsky:
"Light Diffraction by a Single Domain Wall";
Journal of Magnetism and Magnetic Materials,
203
(1999),
S. 247
- 249.
Y. Didosyan, H. Hauser, J. Nicolics, V. Barash, P.L. Fulmek:
"Magneto-optical Current Sensor by Domain Wall Motion in Orthoferrites";
IEEE Transactions on Instrumentation and Measurement,
49
(2000),
S. 14
- 18.
Y. Didosyan, H. Hauser, J. Nicolics:
"Magneto-optical Current Sensors of High Bandwidth";
Sensors and Actuators A: Physical,
81
(2000),
S. 263
- 267.
Y. Didosyan, H. Hauser, J. Nicolics, G. Hanreich, H. Wolfmayr:
"Magneto-Optical method for Measuring Mechanical Quantities";
IEEE Transactions on Instrumentation and Measurement,
51
(2002),
4;
S. 730
- 733.
Y. Didosyan, H. Hauser, H. Wolfmayr, J. Nicolics, P.L. Fulmek:
"Magneto-optical totational speed sensor";
Sensors and Actuators A: Physical,
106
(2003),
S. 168
- 171.
M. Fasching, J. Nicolics:
"Thermische Analyse des Pulslastverhaltens von Drahtwiderständen";
Plus,
11
(2009),
1;
S. 179
- 184.
P.L. Fulmek, I. Atassi, G. Radosavljevic, A. Maric, J. Nicolics, W. Smetana:
"Temperature Dependence of the Quasi-Static Properties of LTCC-Ferrites - First Results";
Berichte aus der Elektrotechnik: Proceedings E!4570 IPCTECH. New Generation of 3-D Integrated Passive Components & Microsystems in LTCC-Technology,
1
(2011),
S. 65
- 71.
P.L. Fulmek, P. Haumer, F. Wenzl, W. Nemitz, J. Nicolics:
"Time dependent and temperature dependent properties of the forward voltage characteristic of InGaN high power LEDs";
AIP Advances,
7
(2017),
S. 035206-1
- 035206-13.
P.L. Fulmek, J. Nicolics, W. Nemitz, F. Wenzl:
"On the impact of the temperature dependency of the phosphor quantum efficiency on correlated color temperature stability in phosphor converted LEDs";
Materials Chemistry and Physics,
196
(2017),
S. 82
- 91.
P.L. Fulmek, J. Nicolics, S. Schweitzer, C. Sommer, P. Hartmann, F. Schrank, F. Wenzl:
"The impact of the thermal conductivities of the color conversion elements of phosphor converted LEDs under different current driving schemes";
Journal of Luminescence,
169
(2015),
Part B;
S. 559
- 568.
P.L. Fulmek, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, G. Langer, J. Nicolics, F. Wenzl:
"On the Thermal Load of the Color-Conversion Elements in Phosphor-Based White Light-Emitting Diodes";
Advanced Optical Materials,
1
(2013),
10;
S. 753
- 762.
P.L. Fulmek, C. Sommer, P. Hartmann, F. Wenzl, P. Pachler, H. Hoschopf, G. Langer, J. Nicolics:
"Color temperature constancy of phosphor converted LED modules: a combined thermal and optical simulation study on the materials requirements";
E&I Elektrotechnik und Informationstechnik,
129
(2012),
S. 1
- 5.
W. Gschohsmann, J. Nicolics, E. Suhir:
"Deformations in stretched surface mounted ceramic strips for sensor applications";
Microelectronics International,
28
(2011),
3;
S. 19
- 23.
W. Gschohsmann, J. Nicolics, E. Suhir:
"Elastizitätsmodell eines keramischen Sensorstreifens bei longitudinaler Verformung";
E&I Elektrotechnik und Informationstechnik,
127
(2010),
10;
S. 279
- 284.
G. Hanreich, M. Mayer, M. Mündlein, J. Nicolics:
"Thermal investigation of GaAs microwave power transistors";
Journal of Microelectronics and Electronic Packaging,
vol. 1
(2004),
S. 1
- 8.
G. Hanreich, M. Mündlein, H. Hauser, J. Nicolics, G. Stangl, R. Grössinger, J. Espina-Hernandez:
"Ultra-thin pick-up coil for surface flux detection";
Sensors and Actuators A: Physical,
91
(2001),
S. 57
- 60.
G. Hanreich, J. Nicolics, H. Hauser:
"Silizium-Substrate mit Mikro-Whisker-Strukturierung für verbesserte Wärmeabfuhr in der Leistungselektronik";
VTE Aufbau- und Verbindungstechnik in der Elektronik,
12
(2000),
S. 138
- 143.
G. Hanreich, J. Nicolics, H. Hauser:
"Silicon-Microwhisker-Heat-Spreader for Enhanced Heat Transfer in Power Electronics";
Packaging and Interconnection Technology in Electronics,
12
(2000),
S. E45
- E48.
G. Hanreich, J. Nicolics, M. Mündlein, H. Hauser, R. Chabicovsky:
"A new bonding technique for human skin humidity sensors";
Sensors and Actuators A: Physical,
92
(2001),
S. 364
- 369.
G. Hanreich, J. Nicolics, L. Musiejovsky:
"High Resolution Thermal Simulation of Electronic Components";
Microelectronics Reliability,
40
(2000),
S. 2069
- 2076.
G. Hanreich, J. Nicolics, L. Musiejovsky:
"Plastic-encapsulated components for cars";
IEEE Instrumentation & Measurement Magazine,
4
(2001),
2;
S. 16
- 21.
G. Hanreich, J. Nicolics, G. Stangl:
"Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices";
Microelectronics Journal,
31
(2000),
11-12;
S. 969
- 973.
H. Hauser, I. Giouroudi, J. Steurer, L. Musiejovsky, J. Nicolics:
"Magnetic Hysteresis Modeling of Thin Film Giant Magnetoimpedance Sensors";
Sensor Letters,
5
(2007),
1;
S. 133
- 137.
H. Hauser, J. Nicolics, R. Steindl, C. Hausleitner, A. Pohl:
"Miniaturized Magnetic Field Sensors Utilizing Giant Magneto-Impedance [GMI] Effect and surface Acoustic Wave [SAW] Technology";
Sensors and Materials (eingeladen),
13
(2001),
1;
S. 25
- 40.
H. Hauser, R. Steindl, C. Hausleitner, A. Pohl, J. Nicolics:
"Wirelessly Interrogable Magnetic Field Sensor Utilizing Giant Magneto-Impedance Effect and Surface Acoustic Wave Devices";
IEEE Transactions on Instrumentation and Measurement Technology,
49
(2000),
S. 648
- 652.
H. Hauser, J. Steurer, J. Nicolics, I. Giouroudi:
"Wireless Magnetic Field Sensor";
Journal of Electrical Engineering,
57
(2006),
12;
S. 9
- 14.
G. Langer, M. Leitgeb, J. Nicolics, M. Unger, H. Hoschopf, F. Wenzl:
"Advanced Thermal Management Solutions on PCBs for High-Power Applications";
SMT Magazine,
6
(2014),
S. 12
- 32.
G. Langer, J. Nicolics:
"Thermische Analysen von Multilayer-Leiterplatten mit integrierten optischen Verbindungen";
Produktion von Leiterplatten und Systemen,
9
(2007),
11;
S. 2243
- 2250.
M. Lederer, Z. Goekdeniz, G. Khatibi, J. Nicolics:
"Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages";
Microelectronics Reliability,
126
(2021),
114209;
S. 1
- 7.
P. Mashkov, B. Gyoch, S. Penchev, H. Beloev, J. Nicolics:
"Equipment and Method for Power LEDs' Thermal Loading Testing During Operation";
PLUS - Produktion von Leiterplatten und Systemen. Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik,
14
(2012),
12;
S. 2738
- 2742.
A. Mazloum Nejadari, G. Khatibi, B. Czerny, M. Lederer, J. Nicolics, L. Weiss:
"Reliability of Cu wire bonds in microelectronic packages";
Microelectronics Reliability (eingeladen),
74
(2017),
1;
S. 147
- 154.
G. Miskovic, O. S. Aleksic, M. V. Nikolic, J. Nicolics, G. Radosavljevic, Z. Z. Vasiljevic, M. D. Lukovic, W. Smetana:
"Nanostructured SnO2 thick films for gas sensor application: analysis of structural and electronic properties";
IOP Conference Series: Materials Science and Engineering,
108
(2016),
6 S.
Zusätzliche Informationen
M. Mündlein, J. Nicolics:
"Modeling of Particle Arrangement in an Isotropically Conductive Adhesive Joint";
IEEE Trans. on components and packaging technologies,
28
(2005),
4;
S. 765
- 770.
M. Mündlein, B. Valentin, R. Chabicovsky, J. Nicolics, J. Weremczuk, G. Tarapata, R. Jachowicz:
"Comparison of transepidermal water loss (TEWL) measurements with two novel sensors based on different sensing principles";
Sensors and Actuators A: Physical,
142
(2008),
S. 67
- 72.
W. Nemitz, P.L. Fulmek, J. Nicolics, F. Reil, F. Wenzl:
"On the determination of the temperature distribution within the color conversion elements of phosphor converted LEDs";
Scientific Reports,
7
(2017),
9964;
10 S.
W. Nemitz, F. Wenzl, S. Schweitzer, C. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics:
"Iterative Optical and Thermal Simulation Method for Proper Simulation of PC LEDs";
LED Professional Review,
52
(2015),
S. 48
- 53.
W. Nemitz, F. Wenzl, S. Schweitzer, C. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics:
"Self-Compensation Approach for Maintaining the Chromaticity Coordinates of Phosphor Converted LEDs Upon Temperature Variations";
LED Professional Review,
1
(2014),
S. 54
- 60.
J. Nicolics:
"Multifunktionale Leiterplatte";
Produktion von Leiterplatten und Systemen,
9
(2007),
11;
S. 2049.
J. Nicolics:
"Thermal Management";
Plus,
11
(2009),
1;
S. 1.
Zusätzliche Informationen
J. Nicolics:
"Thermal Management";
PLUS - Produktion von Leiterplatten und Systemen. Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik (eingeladen),
14
(2012),
10;
S. 2089.
J. Nicolics, P.L. Fulmek, W. Nemitz, F. Wenzl:
"Analysis of the local temperature distribution in color conversion Analysis of the local temperature distribution in color conversion";
International Journal of Heat and Mass Transfer,
116
(2018),
S. 1076
- 1107.
J. Nicolics, H. Hauser:
"Laser Micromachining of Ceramics";
Veitsch-Radex-Rundschau,
2
(2000),
S. 16
- 23.
J. Nicolics, L. Musiejovsky, R. Chabicovsky:
"Das Laserlöten als Kontaktierungsverfahren für Mikrosensoren";
E&I Elektrotechnik und Informationstechnik,
115
(1998),
7/8;
S. 396
- 402.
J. Nicolics, L. Musiejovsky, M. Mündlein, J. Steurer, I. Giouroudi, H. Hauser, J. Zehetner:
"Laser Welding Process Optimization for the Production of GMI Magnetic Field Sensors";
Sensor Letters,
5
(2007),
1;
S. 204
- 206.
J. Nicolics, L. Musiejovsky, H. Schrottmayer:
"A New Characterization of Wettability. Part I: Modeling of Dynamic Wetting Processes";
Joining in Electronics and Precision Mechanics,
8
(1996),
1;
S. 8
- 11.
J. Nicolics, L. Musiejovsky, H. Schrottmayer, W. Ziegler:
"A New Characterization of Wettability. Part II: Applications as Demonstrated by Laser Soldering of SMDs";
Joining in Electronics and Precision Mechanics,
8
(1996),
2;
S. 18
- 22.
Zusätzliche Informationen
J. Nicolics, L. Musiejovsky, H. Schrottmayer, W. Kremser:
"Comparison of the Thermal Characteristics of Plastic and Ceramic Packages for Medical Applications";
Transactions on Precision and Electronic Technology,
36
(1997),
3;
S. 175
- 180.
J. Nicolics, L. Musiejovsky, J. Steurer, I. Giouroudi, H. Hauser, M. Mündlein, S. Zoppel, J. Zehetner:
"Laser Welding Process Optimization for the Production of Giant Magnetoimpedance Magnetic Field Sensors";
Sensor Letters,
5
(2007),
1;
S. 204
- 207.
J. Nicolics, H. Schrottmayer, L. Musiejovsky:
"Eine neue Charakterisierung der Benetzbarkeit. Teil 1: Modellbildung für dynamische Benetzungsvorgänge";
Verbindungstechnik in der Elektronik & Feinwerktechnik (VTE),
8
(1996),
1;
S. 21
- 27.
J. Nicolics, H. Schrottmayer, L. Musiejovsky:
"Eine neue Charakterisierung der Benetzbarkeit. Teil 2: Anwendung am Beispiel des Laserlötens von SMDs";
Verbindungstechnik in der Elektronik & Feinwerktechnik (VTE),
8
(1996),
2;
S. 72
- 80.
Zusätzliche Informationen
H. Schrottmayer, J. Nicolics, L. Musiejovsky:
"Investigation of a New Measuring Method for the Dynamic Wettability using Laser Technology";
Transactions on Precision and Electronic Technology,
3
(1997),
S. 113
- 118.
S. Schweitzer, Ch. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, F. Wenzl:
"A comprehensive discussion on colour conversion element design of phosphor converted LEDs";
Journal of Solid State Lighting,
1
(2014),
18;
S. 14.
N. Sekiguchi, T. Komeda, H. Funakubo, R. Chabicovsky, J. Nicolics, G. Stangl:
"Microsensor for the measurement of water content in the human skin";
Sensors and Actuators B: Chemical,
78
(2001),
S. 326
- 330.
J. Silvano de Sousa, M. Unger, P.L. Fulmek, P. Haumer, J. Nicolics:
"Erhöhtes Wärmespreiz-vermögen von Leiterplatten durch eingebettete Heat-Pipes";
PLUS - Produktion von Leiterplatten und Systemen. Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik,
2
(2018),
S. 290
- 299.
R. Steindl, C. Hausleitner, A. Pohl, H. Hauser, J. Nicolics:
"Passive wirelessly requestable sensors for magnetic field measurements";
Sensors and Actuators A: Physical,
85
(2000),
S. 169
- 174.
E. Suhir, A. Bensoussan, J. Nicolics:
"Predicted Device-Degradation Failure-Rate";
SAE Technical Paper Series,
1
(2015),
10 S.
E. Suhir, A. Bensoussan, J. Nicolics:
"Predicted elastic stability of a dual-coated fiber-optic connector";
Microelectronics Reliability,
1
(2014),
13 S.
E. Suhir, R. Ghaffarian, J. Nicolics:
"Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?";
Journal of Materials Science, Materials in Electronics,
26
(2015),
12;
S. 10062
- 10067.
E. Suhir, R. Ghaffarian, J. Nicolics:
"Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?";
Journal of Materials Science, Materials in Electronics,
27
(2016),
1;
S. 570
- 579.
Zusätzliche Informationen
E. Suhir, R. Ghaffarian, J. Nicolics:
"Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends";
Journal of Materials Science, Materials in Electronics,
27
(2016),
6;
S. 5563
- 5574.
E. Suhir, R. Ghaffarian, J. Nicolics:
"Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design";
Journal of Materials Science, Materials in Electronics,
27
(2016),
3;
S. 2430
- 2441.
Zusätzliche Informationen
E. Suhir, R. Ghaffarian, S. Yi, J. Nicolics:
"Assessed interfacial strength and elastic moduli of the bonding material from shear-off test data";
Journal of Materials Science, Materials in Electronics,
28
(2017),
S. 6794
- 6799.
E. Suhir, W. Gschohsmann, J. Nicolics:
"Analysis of a bi-material strip";
ZAMM - Zeitschrift für Angewandte Mathematik und Mechanik,
92
(2012),
4;
S. 320
- 328.
E. Suhir, W. Gschohsmann, J. Nicolics:
"Analysis of an elongated stretched strip, with application to a strain-gage electrical sensor design";
ZAMM - Zeitschrift für Angewandte Mathematik und Mechanik,
1
(2010),
S. 1
- 9.
E. Suhir, W. Gschohsmann, J. Nicolics:
"Analysis of an elongated stretched strip, with application to a strain-gage electrical sensor design";
ZAMM - Zeitschrift für Angewandte Mathematik und Mechanik,
91
(2011),
4;
S. 330
- 338.
E. Suhir, S. Kang, J. Nicolics, C. Gu, A. Bensoussan, L. Bechou:
"Predicted thermal stresses in a cylindrical tri-material body, with application to optical fibers embedded into silicon";
Journal of Electrical and Control Engineering (JECE),
3
(2013),
6;
S. 9
- 14.
E. Suhir, J. Nicolics:
"Analysis of a Bow-Free Prestressed Test Specimen";
Journal of Biomechanical Engineering - Transactions of the ASME,
81
(2014),
11;
S. 1145021
- 1145024.
E. Suhir, J. Nicolics:
"Bending of a bi-material cantilever beam, with consideration of the role of the interfacial shearing stress";
ZAMM - Zeitschrift für Angewandte Mathematik und Mechanik,
92
(2012),
7;
S. 573
- 582.
E. Suhir, J. Nicolics:
"Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal Stresses";
Journal of Materials Science, Materials in Electronics,
27
(2016),
7;
S. 7646
- 7656.
E. Suhir, S Yi, J. Nicolics, G. Khatibi, M. Lederer:
"Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stresses";
Journal of Materials Science, Materials in Electronics,
27
(2016),
9;
S. 9356
- 9362.
M. Unger, W. Smetana, J. Nicolics:
"Analyses of Fluid Temperature Profile in a Continuous-Flow Heater for Lab-In-Module Application";
Berichte aus der Elektrotechnik: Proceedings E!4570 IPCTECH. New Generation of 3-D Integrated Passive Components & Microsystems in LTCC-Technology,
1
(2011),
S. 92
- 107.
B. Valentin, M. Mündlein, R. Chabicovsky, J. Nicolics:
"A Novel Transepidermal Water Loss Sensor";
IEEE Sensors Journal,
6
(2006),
4;
S. 1022
- 1026.
G. Weichslberger, J. Nicolics:
"Entwärmung durch innovative Leiterplattentechnologie am Beispiel eines Operationsscheinwerfers auf LED-Basis";
Plus,
11
(2009),
1;
S. 155
- 166.
M. Weilguni, W. Smetana, J. Nicolics, W. Kausel, W. Goebl:
"Influence of lamination parameters on mechanical properties of low temperature co-fired ceramic tapes";
Microelectronics Reliability,
51
(2011),
S. 1253
- 1256.
F. Wenzl, P.L. Fulmek, C. Sommer, S. Schweitzer, W. Nemitz, P. Hartmann, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, J. Nicolics:
"Impact of extinction coefficient of phosphor on thermal load of color conversion elements of phosphor converted LEDs";
Journal of Rare Earths,
32
(2014),
3;
S. 201
- 206.
F. Wenzl, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, G. Langer, P.L. Fulmek, J. Nicolics:
"The impact of the non-linearity of the radiant flux on the thermal load of the color conversion elements in phosphor converted LEDs under different current driving schemes";
Optics Express,
21
(2013),
S3;
S. 439
- 449.
Editorials in wiss. Zeitschriften
J. Nicolics:
"Editorial - Thermal Management";
PLUS - Produktion von Leiterplatten und Systemen. Fachzeitschrift für Aufbau- und Verbindungstechnik in der Elektronik,
1
(2018),
S. 1.
Buchbeiträge
Y. Didosyan, H. Hauser, J. Nicolics:
"Magnetooptical Surface Evaluation";
in: "Nonlinear Electromagnetic Systems; Studies in Applied Electromagnetics and Mechanics",
J. Pávó, G. Vértesy, T. Takagi, S.S. Volpa (Hrg.);
IOS Press,
Amsterdam,
2001,
ISBN: 1-58603-155-4,
S. 147
- 150.
Y. Didosyan, H. Hauser, J. Nicolics, V. Barash, F. Haberl, P.L. Fulmek:
"Magneto-Optical Sensor";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 57
- 76.
G. Hanreich, M. Mündlein, H. Hauser, J. Nicolics, G. Stangl, R. Grössinger, J. Espina-Hernandez:
"Ultra Thin Pick-up Coil for Surface Flux Detection";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 171
- 176.
G. Hanreich, J. Nicolics:
"Thermal Investigation of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Industry";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 275
- 282.
G. Hanreich, J. Nicolics, M. Mündlein, H. Hauser, R. Chabicovsky:
"Development of a New Bonding Technique for Human Skin Humidity Sensors";
in: "Eurosensors XIV Proceedings",
R. de Reuss, S. Bouwstra (Hrg.);
MIC - Mikroelektronik Centret, Denmark,
Kgs. Lyngby,
2000,
ISBN: 87-89935-50-0,
S. 271
- 274.
G. Hanreich, J. Nicolics, M. Mündlein, H. Hauser, R. Chabicovsky:
"Development of a New Bonding Technique for Human Skin Humidity Sensors";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 145
- 150.
G. Hanreich, J. Nicolics, L. Musiejovsky:
"High Resolution Thermal Simulation of Electronic Components";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 257
- 268.
G. Hanreich, J. Nicolics, G. Stangl:
"Investigation of the Thermal Performance of Micro-Whisker Structured Silicon Heat Spreaders for Power Devices";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 267
- 274.
G. Hanreich, K.-J. Wolter, J. Nicolics:
"Rework of Flip-Chip Populated PCBs by Laser Desoldering";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 283
- 289.
H. Hauser, R. Steindl, C. Hausleitner, J. Nicolics, A. Pohl:
"Miniaturized Magnetic Field Sensors Utilizing GMI Effect and SAW Technology";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 127
- 136.
M. Mündlein, J. Nicolics, A. Aghzout, G. Hanreich, R. Chabicovsky, J. Morris:
"Investigation of Conductive Adhesives";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 199
- 220.
M. Mündlein, J. Nicolics, R. Chabicovsky, N. Sekiguchi, T. Komeda, H. Funakubo, G. Stangl:
"Innovative Packaging Concept of a Miniaturized Skin Moisture Sensor and First Measuring Results";
in: "[sensor & packaging]",
ÖVE,
Wien, Austria,
2003,
ISBN: 3-85133-032-3,
S. 159
- 162.
J. Nicolics, M. Mündlein:
"Electrically Conductive Adhesives";
in: "Micro- and Opto-Eletronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaking, Volume 2",
Springer-Verlag,
2007,
S. 571
- 610.
J. Nicolics, T. Walla:
"Embedded Components";
in: "Handbuch der Leiterplattentechnik",
5;
herausgegeben von: Leuze;
Leuze Verlag,
2019,
ISBN: 978-3-87480-355-7,
S. 1
- 91.
N. Sekiguchi, T. Komeda, H. Funakubo, R. Chabicovsky, J. Nicolics, G. Stangl:
"Microsensors for the measurement of water content in the human skin";
in: "CD-ROM Proceedings",
R. de Reuss, S. Bouwstra (Hrg.);
MIC - Mikroelektronik Centret, Denmark,
Copenhagen, Denmark,
2000,
ISBN: 87-89935-50-0,
S. 407
- 410.
Beiträge in Tagungsbänden
I. Atassi, E. Bauer, J. Nicolics, B. Dangl, L. Spendlhofer, D. Knospe, F. Faistauer:
"Current Thermoelectric Materials and an Evaluation of Thermoelectric Material Contacting Approaches";
in: "Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology",
IEEE Xplore,
2012,
ISBN: 978-1-4673-2240-9,
S. 70
- 75.
Y. Didosyan, H. Hauser, G.A. Reider, J. Nicolics:
"Synchronization Measurement of a Polarization Independent Magneto-Optical Switch";
in: "Proceedings of the 28th ISSE",
IEEE Press,
2005,
ISBN: 0-7803-9324-4,
S. 69
- 71.
M. Franz, J. Nicolics:
"Environmental aspects of white LED lighting systems: Energy statistics, study parameters, rare earths";
in: "Proceedings of the 38th Int. Spring Seminar on Electronics Technology",
IEEE Xplore,
2015,
ISBN: 978-1-4799-8860-0,
S. 396
- 402.
M. Franz, M. Unger, G. Schmid, J. Nicolics:
"Environmental Assessment of a New Developed Camera System for Automotive Application";
in: "Proceedings of the 2018 41st International Spring Seminar on Electronics Technology (ISSE)",
IEEE Xplore,
2018,
ISBN: 978-1-5386-5731-7,
S. 1
- 7.
M. Franz, M. Unger, H. Stahr, M. Morianz, R. Kollmann, J. Nicolics:
"Environmental aspects of new embedded power modules with 500 W and 50 kW";
in: "IEEE 2017 40th International Spring Seminar on Electronics Technology (ISSE)",
IEEE Xplore,
2017,
ISBN: 978-1-5386-0582-0,
S. 1
- 6.
P.L. Fulmek, P. Haumer, M. Weilguni, J. Nicolics:
"High-Resolution Thermography for High-Power LED Quality Control";
in: "Abstracts Proceedings",
34th International Spring Seminar on Electronics Technology,
2011,
ISBN: 978-80-553-0646-9,
S. 222
- 223.
P.L. Fulmek, G. Langer, F. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, J. Nicolics:
"Direct Junction Temperature Measurement in High-Power LEDs";
in: "Proceedings 37th Int. Spring Seminar on Electronics Technology",
IEEE Computer Society,
2014,
ISBN: 978-1-4799-4455-2,
6 S.
R. Glatz, P.L. Fulmek, J. Nicolics, S. Skerlan, M. Siegele, G. Radosavljevic:
"Comparison of Two High-End Infrared Thermography Systems with Different Spectral Sensitivity for Thermal Investigations of Sensor Heater Elements";
in: "Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology",
IEEE Xplore,
2012,
ISBN: 978-1-4673-2240-9,
S. 107
- 113.
Z. Goekdeniz, M. Lederer, G. Khatibi, J. Nicolics:
"Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered Silver";
in: "44th Int. Spring Seminar on Electronics Technology (ISSE)",
1;
herausgegeben von: ieee;
IEEE Conference Publications,
2021,
ISSN: 2161-2536,
S. 1
- 6.
Zusätzliche Informationen
W. Gschohsmann, J. Nicolics:
"A model to specify the deformations in ceramic sensor strips subjected to surface displacements in the contact area";
in: "Proceedings of the 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference, Wroclaw; 22.09.2010 - 25.09.2010",
Wroclaw University of Technology,
2010.
P. Krivic, F. Wenzl, C. Sommer, G. Langer, P. Pachler, H. Hoschopf, P.L. Fulmek, J. Nicolics:
"Investigation of Thermal Properties of Power LED Illumination Assemblies";
in: "Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology",
IEEE Xplore,
2012,
ISBN: 978-1-4673-2240-9,
S. 76
- 83.
A. Maric, I. Atassi, N. V. Blaz, G. Radosavljevic, L. Zivanov, H. Homolka, W. Smetana, J. Nicolics:
"Complex Permeability Variation of Ferritic LTCC in Dependence on Firing Temperature";
in: "Abstracts Proceedings",
34th International Spring Seminar on Electronics Technology,
2011,
S. 204
- 205.
P. Mashkov, B. Gyoch, S. Penchev, H. Beloev, J. Nicolics:
"Method for In-Situ Thermal Load Testing of High-Brightness LED Arrays";
in: "Proceedings of the 2013 36th International Spring Seminar on Electronics Technology",
IEEE Xplore,
2013,
ISBN: 978-1-4799-0036-7,
S. 41
- 46.
B. Nagl, J. Nicolics, W. Gschohsmann:
"Analysis of Thermomechanically Related Failures of Traction IGBT Power Modules at Short Circuit Switching";
in: "Conference Proceedings",
3rd Electronics System Integration Technology Conference, ESTC 2010, Berlin,
2010,
S. 1
- 6.
B. Nagl, E. Suhir, W. Gschohsmann, J. Nicolics:
"Transient Thermomechanical Study of a Thick-Wire Bond With Particular Attention to the Interfacial Shearing Stress";
in: "Conference Proceedings of the 2012 35th International Spring Seminar on Electronics Technology",
IEEE Xplore,
2012,
ISBN: 978-1-4673-2240-9,
S. 339
- 344.
J. Nicolics, G. Langer, F. Lutschounig, K. Lang, R. Huber:
"Impact of Printed Circuit Board Technology on Thermal Performance of High-Power LED Assembly - Experimental Results";
in: "Conference Proceedings",
3rd Electronics System Integration Technology Conference, ESTC 2010, Berlin,
2010,
ISBN: 978-1-4244-8553-6,
S. 1
- 6.
M. Recheis, J. Nicolics, H. Wegleiter, B. Schweighofer, P.L. Fulmek:
"Inductive Displacement Measurement for a Basic Active Magnetic Bearing Test Rig";
in: "Abstracts Proceedings",
34th International Spring Seminar on Electronics Technology,
2011,
ISBN: 978-80-553-0646-9,
S. 120
- 121.
M. Weilguni, W. Gschohsmann, W. Smetana, J. Nicolics, W. Goebl:
"An Analytical Model for a Multilayer Low Temperature Co-Fired Ceramics Laminate";
in: "Abstracts Proceedings",
34th International Spring Seminar on Electronics Technology,
2011,
ISBN: 978-80-553-0646-9,
S. 194
- 195.
M. Weilguni, J. Nicolics, R. Medek, M. Franz, G. Langer, F. Lutschounig:
"Characterization of the thermal impedance of high-power LED assembly based on innovative printed circuit board technology";
in: "Conference Proceedings",
herausgegeben von: IEEE;
IEEE Xplore,
2010,
ISBN: 978-1-4244-7849-1,
7 S.
Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag)
A. Aghzout, J. Nicolics:
"Investigation of the Electric Resistance of Anisotropic Adhesive Bondings for Power Electronic Applications";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Neusiedl am See, Austria;
04.05.1998
- 07.05.1998; in: "Proceedings of 21st International Spring Seminar on Electronics Technology (ISSE 98)",
Werkstoffe der Elektrotechnik,
Wien
(1998),
ISBN: 3-85465-004-3;
S. 146
- 150.
Zusätzliche Informationen
A. Aghzout, J. Nicolics, R. Chabicovsky:
"Investigation of Anisotropic Conductive Adhesive Bondings after Aging and Under High Current Load";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Balatonfüred, Ungarn;
06.05.2000
- 10.05.2000; in: "Proceedings of the 23rd International Spring Seminar on Electronics Technology (ISSE2000)",
(2000),
S. 241
- 246.
A. Aghzout, J. Nicolics, R. Chabicovsky:
"Investigation of anisotropically conductive adhesive interconnections between copper tracks with Pd and Ni/Au finish";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Dresden, Deutschland;
18.05.1999
- 20.05.1999; in: "Proceedings of the 22nd Intern. Spring Seminar on Electronics Technology",
(1999),
S. 332
- 337.
D. Andrijasevic, W. Brenner, J. Nicolics:
"Multilayer Adhesive Bonding Under Hot Air Stream";
Poster: Junior Scientist Conference 2006,
Wien, Austria;
19.04.2006
- 21.04.2006; in: "Junior Scientist Conference 2006 - Proceedings",
(2006),
ISBN: 3-902463-05-8;
S. 89
- 90.
Zusätzliche Informationen
G. Artner, P. K. Gentner, J. Nicolics, C. Mecklenbräuker:
"Material Characterisation of Carbon-Fiber Compounds with the NRW Method";
Vortrag: COST IC1004 13th MC & Scientific Meeting,
Valencia;
05.05.2015
- 07.05.2015; in: "Cost IC1004: 12th MC & Scientific Meeting",
(2015),
S. 1
- 6.
Zusätzliche Informationen
I. Atassi, E. Bauer, J. Nicolics:
"Review of Current Thermoelectric Materials and an Evaluation of a Cascading Approach";
Poster: 35th International Spring Seminar on Electronics Technology (ISSE 2012),
Bad Aussee;
09.05.2012
- 13.05.2012; in: "Book of Abstracts",
(2012),
ISBN: 978-3-85465-015-7;
S. 34
- 35.
I. Atassi, E. Gaubitzer, G. Köhler, M. Edetsberger, W. Smetana, J. Nicolics:
"Characterization of a Reactor Module by Means of 3 - Dimensional Finite Element - Analyses";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Budapest, Hungary;
07.05.2008
- 11.05.2008; in: "ISSE 2008 Conference Proceedings",
(2008),
ISBN: 978-963-06-4915-5;
S. 658
- 663.
I. Atassi, W. Smetana, E. Gaubitzer, M. Edetsberger, G. Köhler, J. Nicolics:
"Performance Optimization of a Reactor Module by Means of 3-Dimensional Finite Element-Analyses";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Budapest, Hungary;
07.05.2008
- 11.05.2008; in: "Abstract Proceedings - Reliability and Life-time Prediction",
(2008),
ISBN: 978-963-06-4915-5;
S. 304
- 305.
M. Brandl, K.-H. Kellner, M. Mündlein, J. Nicolics:
"Low-Cost Wireless Transponder System for Industrial and Biomedical Applications";
Vortrag: Int.Conf. on Information, Communication and Signal Processing (ICICS),
Bangkok, Thailand;
06.12.2005
- 09.12.2005; in: "Proceedings ICICS 2005",
(2005),
S. 1444
- 1447.
R. Chabicovsky, L. Musiejovsky, J. Nicolics:
"Laser Soldering of Sensors with Thin Film Metallizations";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Neusiedl, Austria;
04.05.1998
- 07.05.1998; in: "Proceedings of the 21st Intern. Spring Seminar on Electronics Technology",
(1998),
S. 160
- 164.
R. Chabicovsky, J. Nicolics:
"Dünnschicht-Thermoelemente aus W-NiCr für die thermische Analyse eines Laser-Lötprozesses";
Vortrag: Förderverein für Sensorik e.V. JENASENSORIC,
Jena, Deutschland;
10.10.1997
- 12.10.1997; in: "Tagungsbericht 9. Workshop Mikrotechniken und Mikrosensoren für Umwelt, Biologie und Medizin",
(1997),
ISSN: 1434-7288;
S. 18
- 19.
Y. Didosyan, H. Hauser, D. Drvoderic, J. Nicolics:
"Large aperture and high speed optical rotator";
Vortrag: Int. Symposium on Non-Linear Electromagnetic Systems (ISEM),
Bad Gastein;
12.09.2005
- 14.09.2005; in: "ISEM 2005 Short Paper Proceedings",
(2005),
3-902105-00-1;
S. 402
- 403.
Y. Didosyan, H. Hauser, W. Fiala, J. Nicolics, W. Toriser:
"A New Magnetooptical Switch on Orthoferrite";
Poster: Informationstagung Mikroelektronik (ME),
Wien, Ö;
10.10.2001
- 11.10.2001; in: "Beiträge der Informationstagung ME01",
D. Donhoffer, G. Fiedler (Hrg.);
ÖVE-Schriftenreihe,
26
(2001),
ISBN: 3-85133-022-6;
S. 129
- 134.
Y. Didosyan, H. Hauser, J. Nicolics, F. Haberl, R. Chabicovsky:
"Application of Orthoferrites for Angular Measurements";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Dresden, Germany;
18.05.1999
- 20.05.1999; in: "Proc. of ISSE 99",
(1999),
ISBN: 3-934142-00-1;
S. 204
- 207.
Zusätzliche Informationen
Y. Didosyan, H. Hauser, J. Nicolics, P.L. Fulmek:
"Electrical Current Sensors Based on Transparent Magnets";
Vortrag: IEEE Instrumentation & Measurement Technology Conference (IMTC 98),
St. Paul, Minnesota, USA;
18.05.1998
- 21.05.1998; in: "Proceedings",
(1998),
S. 977
- 980.
Y. Didosyan, H. Hauser, J. Nicolics:
"Magneto-optical Angle Measurements";
Vortrag: 44th Annual Conference on Magnetism & Magnetic Materials (MMM 99),
San Jose, USA;
15.11.1999
- 18.11.1999; in: "MMM 99-Abstracts",
(1999),
S. 398.
Y. Didosyan, H. Hauser, J. Nicolics:
"Magneto-optical Measurements of Geometrical Quantities";
Poster: XVI IMEKO World Congress 2000,
Wien;
25.09.2000
- 28.09.2000; in: "IMEKO 2000 Abstracts",
(2000),
S. 246.
Zusätzliche Informationen
Y. Didosyan, H. Hauser, J. Nicolics:
"Magneto-optical Surface Evaluation";
Poster: 6th Int. Workshop on Electromagnetic Non-destructive Evaluation,
Budapest, Hungary;
28.06.2000
- 30.06.2000; in: "Proceedings of the ENDE 2000",
(2000),
S. 55
- 56.
Zusätzliche Informationen
Y. Didosyan, H. Hauser, J. Nicolics, V. Barash, P.L. Fulmek:
"Electric Current Sensors Based on Transparent Magnets";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Neusiedl am See, Austria;
04.05.1998
- 07.05.1998; in: "ISSE 98 Abstracts S.50 und Proc. of ISSE'98",
Wien
(1998),
ISBN: 3-85465-004-3;
S. 43
- 47.
Y. Didosyan, H. Hauser, J. Nicolics, M. Evanzin, W. Toriser:
"Magneto-optical Rotational Velocity Sensor";
Poster: Joint European Magnetic Symposia JEMS,
Grenoble, Frankreich;
28.08.2001
- 01.09.2001; in: "JEMS'01 Abstracts",
(2001),
S. 199.
Y. Didosyan, H. Hauser, J. Nicolics, F. Haberl, M. Evanzin:
"New Bistable Optical Switch";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Balatonfüred, Hungary;
06.05.2000
- 10.05.2000; in: "ISSE 2000 Abstracts, S. 74 und ISSE 2000 Proceedings",
(2000),
ISBN: 963-420-639-5;
S. 225
- 228.
Y. Didosyan, H. Hauser, J. Nicolics, G. Hanreich:
"Magnetooptical measurements of mechanical quantities";
Vortrag: IEEE Instrumentation & Measurement Technology Conference,
Budapest, Hungary;
21.05.2001
- 23.05.2001; in: "Proceedings of the 18th IEEE Instrumentation & Measurement Technology Conference",
(2001),
ISBN: 0-7803-6646-4;
S. 958
- 961.
Y. Didosyan, H. Hauser, J. Nicolics, I. Yavorsky, P.L. Fulmek:
"Light Diffraction by a Domain Wall of Yttrium Orthoferrite";
Poster: Magnetism of Nanostructured Phases - MNP Conference,
San Sebastian, Spain;
04.09.1998
- 06.09.1998; in: "MNP Abstracts",
(1998),
S. 128.
Y. Didosyan, H. Hauser, G.A. Reider, J. Nicolics:
"Sensors and Actuators on Orthoferrites";
Vortrag: 3rd IEEE Conference on Sensors (IEEE Sensors 2004),
Vienna, Austria;
24.10.2004
- 27.10.2004; in: "CD-ROM Proceedings Sensor 2004",
D. Rocha Wiese Meneses, P. M. Sarro, M. Vellekoop (Hrg.);
(2004),
ISBN: 0-7803-8692-2;
S. 1032
- 1035.
Y. Didosyan, H. Hauser, H. Wolfmayr, J. Nicolics, W. Toriser:
"Fiberoptic MOCT on Orthoferrite";
Vortrag: 47th Annual Conference on Magnetism & Magnetic Materials,
Tampa, Florida, USA;
11.11.2002
- 15.11.2002; in: "Abstracts MMM 02",
(2002),
S. 344.
M. Fasching, G. Hanreich, R. Egger, J. Nicolics, W. Hachmeister:
"Demontage von Leadless Packages mittels Laser-Entlöten";
Vortrag: Elektronische Baugruppen - Aufbau- und Fertigungstechnik,
Fellbach;
06.02.2002
- 07.02.2002; in: "GMM-Fachbericht: Elektronische Baugruppen",
(2002),
S. 227
- 233.
M. Fasching, J. Nicolics:
"Investigation of Pulse Load Behavior of Power Wire-Wound Resistors";
Poster: 32nd International Spring Seminar on Electronics Technology (ISSE),
Brno, Czech Republic;
13.05.2009
- 17.05.2009; in: "ISSE 2009 Conference Proceedings",
(2009),
ISBN: 978-1-4244-4260-7;
S. 184
- 185.
M. Fasching, J. Nicolics, M. Mündlein:
"Minimierung des thermischen Widerstands von SMT-Leistungsbauelementen auf Leiterplatten für Hochtemperaturanwendungen";
Vortrag: DVS/GMM-Fachtagung für Elektronische Baugruppen - Aufbau- und Regelungstechnik,
Fellbach, BRD;
08.02.2006
- 09.02.2006; in: "GMM-Fachbericht No. 50",
(2006),
S. 189
- 194.
T. Fellner, W. Smetana, H. Hauser, J. Nicolics:
"Properties of Low K Thick Film Dielectrics";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Dresden, Germany;
18.05.1999
- 20.05.1999; in: "Proc. of ISSE 99",
(1999),
ISBN: 3-934142-00-1;
S. 382
- 385.
Zusätzliche Informationen
M. Franz, T. Kupka, G. Schmid, J. Nicolics:
"Greenhouse Gas Emissions of Printed Circuit Board Manufacturing of Different Technologies";
Vortrag: 42nd International Spring Seminar on Electronics Technology - ISSE2019,
Wroclaw, Polen;
15.05.2019
- 19.05.2019; in: "42nd International Spring Seminar on Electronics Technology",
(2019),
ISBN: 978-83-7493-070-3;
S. 151
- 152.
Zusätzliche Informationen
P.L. Fulmek, P. Haumer, F. Wenzl, W. Nemitz, R. Beigelbeck, J. Nicolics:
"An Advanced Parametric Thermal Model for High Power LED Modules";
Vortrag: AMA Conferences 2017 - SENSOR 2017 and IRS² 201,
Nürnberg, D;
30.05.2017
- 01.06.2017; in: "Proceedings AMA 2017 - Sensor 2017",
(2017),
6 S.
P.L. Fulmek, W. Nemitz, F. Wenzl, S. Schweitzer, P. Hartmann, J. Nicolics:
"Simulation Based Experimental Study of the Temperature and Power Density Distribution in a High-Power LED";
Vortrag: 38th International Spring Seminar on Electronics Technology-ISSE 2015,
Eger, Hungary;
06.05.2015
- 10.05.2015; in: "Proceedings",
Budapest University of Technology and Economics,
(2015),
ISBN: 978-963-313-177-0;
S. 179
- 182.
P.L. Fulmek, J. Nicolics, R. Glatz, S. Skerlan, M. Siegele:
"Thermal Investigation of a Gas Sensor Heater Element using High-Resolution Thermography";
Vortrag: The 13th Mechatronics Forum International Conference,
Linz;
17.09.2012
- 19.09.2012; in: "Conference Proceedings",
(2012),
S. 366
- 372.
P.L. Fulmek, J. Nicolics, G.A. Reider:
"Demagnetizing Experiments of Yttrium Orthoferrites for Large Aperture Magnetooptical Switch";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Budapest, Hungary;
07.05.2008
- 11.05.2008; in: "ISSE 2008 Conference Proceedings",
(2008),
ISBN: 978-963-06-4915-5;
S. 251
- 256.
P.L. Fulmek, J. Nicolics, F. Wenzl, W. Nemitz, S. Schweitzer, P. Schweitzer:
"Influence of Electrode Structure on Thermal Performance of High Power LED";
Vortrag: 38th International Spring Seminar on Electronics Technology-ISSE 2015,
Eger, Hungary;
01.05.2015
- 02.05.2015; in: "Book of Abstracts",
Budapest University of Technology and Economics,
(2015),
ISBN: 978-963-313-177-0;
S. 96
- 97.
P.L. Fulmek, F. Wenzl, W. Nemitz, S. Schweitzer, H. Hoschopf, G. Langer, J. Nicolics:
"Innovative Junction Temperature Measurement Method Applied on High-Power LED Arrays";
Vortrag: 37th International Spring Seminar on Electronics Technology,
Dresden;
07.05.2014
- 11.05.2014; in: "Proceedings of the 37th ISSE",
(2014),
ISBN: 978-1-4799-4026-4;
S. 36
- 37.
Z. Geokdeniz, G. Khatibi, J. Nicolics, A. Steiger-Thirsfeld:
"Behavior of silver-sintered joints by cycling mechanical loading and influence of temperature";
Poster: EMPC, 22nd Microelectronics an Packaging Conference (EMPC) & Exhibition,
Pisa, Italy;
16.09.2019
- 19.09.2019; in: "EMPC, 22nd Microelectronics an Packaging Conference (EMPC) & Exhibition",
IEEE (Hrg.);
IEEE- Explore,
(2019),
S. 1
- 6.
I. Giouroudi, H. Hauser, J. Nicolics, L. Musiejovsky:
"GMI Effect in Laser Micromachined Wire-Sensors";
Poster: Magnetic Measurements '06,
Zavazna Poruba, Slovakia (eingeladen);
21.09.2006
- 23.09.2006; in: "Magnetic Measurements '06 - The Book of Abstracts",
Slovak University of Technology,
(2006),
ISBN: 80-227-2452-1;
S. 95
- 96.
R. Glatz, P.L. Fulmek, S. Skerlan, M. Siegele, G. Radosavljevic, J. Nicolics:
"Thermal Study of a ZrO2-Based Heater Element by Thermography at Different Spectral Sensitivities";
Poster: 35th International Spring Seminar on Electronics Technology (ISSE 2012),
Bad Aussee;
09.05.2012
- 13.05.2012; in: "Book of Abstracts",
(2012),
ISBN: 978-3-85465-015-7;
S. 46
- 47.
Z. Gökdeniz, G. Khatibi, T. Walter, J. Nicolics:
"Temperature Dependent Mechanical Properties of Sintered Silver-Copper Joints";
Vortrag: 41st International Spring Seminar on Electronics Technology (ISSE),
Zlatibor;
16.05.2018
- 20.05.2018; in: "Book of Abstracts ISSE 2018",
IEEE,
(2018),
ISBN: 978-1-5386-5731-7;
S. 57
- 58.
Z. Goekdeniz, M. Lederer, G. Khatibi, J. Nicolics:
"Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints";
Vortrag: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Gothenburg, Sweden;
13.09.2021
- 16.09.2021; in: "2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)",
(2021),
S. 1
- 5.
Zusätzliche Informationen
Z. Gökdeniz, M. Mündlein, G. Khatibi, A. Steiger-Thirsfeld, J. Nicolics:
"Ermüdungsverhalten hoch-belasteter Ag-Sinterverbindungen";
Vortrag: EBL 2020 - Elektronische Baugruppen und Leiterplatten,
Fellbach, D;
18.09.2020
- 19.09.2020; in: "EBL 2020 - Elektronische Baugruppen und Leiterplatten",
VDE,
(2020),
ISBN: 978-3-8007-5185-3;
S. 204
- 209.
Zusätzliche Informationen
St. Groß, K. Beart, Th. Schmidt, B. Schuch, H. Stahr, M. Morianz, J. Nicolics, M. Unger:
"EmPower - Integrierte Leistungskomponenten für Elektrofahrzeuge";
Vortrag: Elektronische Baugruppen und Leiterplatten EBL 2016 - Multifunktionale Baugruppen - Leistungsdichte am Limit?,
Fellbach, D;
16.02.2016
- 17.02.2016; in: "Tagungsband EBL 2016",
(2016),
6 S.
St. Groß, W. Grübl, B. Schuch, H. Stahr, M. Morianz, L. Böttcher, D. Manessis, J. Nicolics, M. Unger:
"EmPower - Embedded power components for electric vehicle applications";
Vortrag: Automotive Power Electronics, APE 2017,
Paris, France;
26.04.2017
- 27.04.2017; in: "Proceedings APE 2017",
(2017),
7 S.
W. Gschohsmann, J. Nicolics:
"A model to specify the deformations in ceramic sensor strips subjected to surface displacements in the contact area";
Vortrag: 34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference,
Wroclaw;
22.09.2010
- 25.09.2010; in: "Book of Abstracts",
(2010),
ISBN: 978-83-917701-8-4;
S. 178.
E. Hammel, D. Holzer, G. Hanreich, J. Nicolics:
"Silicon Substrates with Microwhisker Structure";
Vortrag: 32nd Int. Symposium on Microelectronics (IMAPS 99),
Chicago;
26.10.1999
- 28.10.1999; in: "Proc. of the 32nd Int. Symposium on Microelectronics",
(1999),
ISBN: 0-930815-58-0;
S. 474
- 479.
Zusätzliche Informationen
E. Hammel, C. Nagl, J. Nicolics, G. Hanreich:
"High Thermal Performance Silicon Heat Spreaders with Micro Whisker Structure";
Poster: 25th International Electronics Manufacturing Technology Symposium (IEMT 99),
Austin, Texas;
18.10.1999
- 20.10.1999; in: "Proceedings 1999 IEMT Symposium",
(1999),
S. 426
- 432.
Zusätzliche Informationen
G. Hanreich, S. Bychikhin, D. Pogany, M. Marso, P. Kordos, J. Nicolics:
"Thermal Simulation and Charakterization of AlGaN/GaN/Si High Electron Mobility Transistors";
Poster: ISSE 2005 - 28th International Spring Seminar on Electronics Technology,
Wiener Neustadt;
19.05.2005
- 22.05.2005; in: "ISSE 2005 - 28th International Spring Seminar on Electronics Technology",
Österreichischer Verband für Elektrotechnik, Wien,
ÖVE Schriftenreihe Nr. 39
(2005),
ISBN: 3-85133036-6;
S. 106
- 107.
Zusätzliche Informationen
G. Hanreich, H. Hauser, J. Nicolics, G. Stangl, R. Grössinger:
"Thin Film Pick-Up Coil for Surface Flux Measurement";
Vortrag: Magnetic Measurements 2000,
Prague, Czech Republic;
11.09.2000
- 12.09.2000; in: "Proceedings of the Conference Magnetic Measurements 2000",
(2000),
S. 1
- 4.
G. Hanreich, H. Hauser, J. Nicolics, G. Stangl:
"Ultra thin pick-up coil for surface flux detection";
Vortrag: 3rd European Conference on Magnetic Sensors & Actuators (EMSA 2000),
Dresden, Germany;
19.07.2000
- 21.07.2000; in: "Book of Abstracts",
13
(2000),
S. 113
- 114.
G. Hanreich, M. Mayer, J. Nicolics:
"Thermal Characterization of GaAs Microwave Power Transistors";
Vortrag: Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (EuroSIME 2002),
Paris, France;
15.04.2002
- 17.04.2002; in: "Proceedings of EuroSIME 2002",
(2002),
S. 234
- 239.
G. Hanreich, M. Mayer, J. Nicolics:
"Thermal Performance of GaAs heterojunction Power Transistors";
Vortrag: 25th International Spring Seminar on Electronics Technology,
Prague, Czech Republic;
11.05.2002
- 14.05.2002; in: "Proceedings ISSE 2002",
(2002),
S. 48
- 52.
G. Hanreich, M. Mündlein, J. Nicolics, M. Mayer:
"Simulationsunterstützte thermische Analyse einer Galliumarsenid-Feldeffekt-Leistungstransistorbaugruppe";
Vortrag: Elektronische Baugruppen - Aufbau- und Fertigungstechnik,
Fellbach;
04.02.2004
- 05.02.2004; in: "GMM-Fachbericht: Elektronische Baugruppen",
(2004),
ISBN: 3-8007-2813-3;
S. 505
- 509.
G. Hanreich, L. Musiejovsky, J. Nicolics:
"Application of the Exodus Method for Thermal Characterization of Electronic Components";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Neusiedl am See, Austria;
04.05.1998
- 07.05.1998; in: "Proc. of 21st International Spring Seminar on Electronics Technology (ISSE 98)",
Werkstoffe der Elektrotechnik,
Wien
(1998),
ISBN: 3-85465-004-3;
S. 172
- 176.
Zusätzliche Informationen
G. Hanreich, L. Musiejovsky, J. Nicolics, K. Riedling:
"Thermal Simulation of High Lead Count Packages";
Vortrag: International Conference on Microelectronics (MIEL),
Nis, Yugoslavia;
14.05.2000
- 17.05.2000; in: "Proc. of MIEL 2000",
IEEE Catalog,
No. 00TH8400
(2000),
S. 351
- 354.
Zusätzliche Informationen
G. Hanreich, L. Musiejovsky, J. Nicolics, K. Riedling:
"Development and Application of an Efficient Algorithm for Thermal Simulation of High-Lead Count Packages";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Freital-Dresden, Germany;
18.05.1999
- 20.05.1999; in: "Conference Proceedings ISSE '99 - Technology Drivers in Electronics",
W. Sauer, K.-J. Wolter (Hrg.);
Verlag Dr. Markus A. Detert,
(1999),
S. 16
- 22.
Zusätzliche Informationen
G. Hanreich, J. Nicolics:
"A New Thermal Simulation Tool Applied for Optimization of Laser Desoldering of Flip-Chip Components";
Vortrag: EuroSimE 2001 - Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics,
Paris;
09.04.2001
- 11.04.2001; in: "Proceedings of EuroSimE 2001",
(2001),
S. 101
- 106.
G. Hanreich, J. Nicolics:
"Measuring the natural convective heat transfer coefficient at the surface of electronik components";
Vortrag: IEEE Instrumentation & Measurement Technology Conference,
Budapest, Hungary;
21.05.2001
- 23.05.2001; in: "Proceedings of the 18th IEEE Instrumentation & Measurement Technology Conference",
(2001),
S. 1045
- 1046.
G. Hanreich, J. Nicolics:
"Thermal Investigation of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Industry";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 167
- 171.
G. Hanreich, J. Nicolics, R. Chabicovsky:
"Thermal Characterization of Micro Whisker Structured Silicon Heatspreader for Power Devices";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Dresden, Germany;
18.05.1999
- 20.05.1999; in: "Proceedings of the 22nd Intern. Spring Seminar on Electronics Technology",
(1999),
S. 193
- 198.
G. Hanreich, J. Nicolics, R. Enigl:
"Determination of the Heat Transfer by Natural Convection at the Surface of Electronic Components";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Balatonfüred, Ungarn;
06.05.2000
- 10.05.2000; in: "Proc. of IEEE, MIEL 2000",
Proc. of 23rd International Spring Seminar on Electronics Technology,
(2000),
S. 191
- 196.
G. Hanreich, J. Nicolics, R. Fasching:
"Thermal Analysis of new Silicon-Based Substrates";
Poster: XVI IMEKO World Congress 2000,
Wien;
25.09.2000
- 28.09.2000; in: "Proceedings IMEKO 2000",
Vol. 2
(2000),
S. 355
- 359.
Zusätzliche Informationen
G. Hanreich, J. Nicolics, H. Hauser:
"Thermal Characterization of Electronic Components Using a New High-Resolution Simulation Tool";
Vortrag: 50th Electronic Components and Technology Conf. ECTE,
Las Vegas, USA;
21.05.2000
- 24.05.2000; in: "IEEE Catalog",
No. 00CH37070
(2000),
ISSN: 0569-5503;
S. 294
- 300.
Zusätzliche Informationen
G. Hanreich, J. Nicolics, K. Riedling:
"Manufacturing a Laser Power Detector in Thick Film Technology and Thermal Optimization of its Design in a Mandatory Laboratory Course";
Vortrag: 5th Intern. Academic Conference on Electronic Packaging, Education and Training,
Dresden, D (eingeladen);
20.03.2002
- 21.03.2002; in: "Proceedings of the 5th Intern. Academic Conference on Electronic Packaging, Education and Training",
R. Tummala, K.-J. Wolter, T. Zerna (Hrg.);
Dr. Markus A. Detert, Templin/Uckermark,
(2002),
ISBN: 3-934142-07-9;
S. 163
- 172.
G. Hanreich, K.-J. Wolter, J. Nicolics:
"Rework of flip-chip populated PCBs by laser desoldering";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 63
- 67.
H. Hauser, I. Giouroudi, J. Nicolics, K. Ludwig, G. Rieder, J. Wecker, G. Daalmans:
"Magnetoimpedance effect in amorphous thin film trilayers";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "Book of Abstracts of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 978-973-713-174-4;
S. 140
- 141.
H. Hauser, I. Giouroudi, J. Nicolics, G. Rieger, J. Wecker, G. Daalmans:
"MI Effect in Amorphous CoFe Thin film Trilayers and Demonstrator Packaging";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "Proc. of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 1-4244-1218-8;
S. 281
- 286.
H. Hauser, J. Nicolics, H. Bruggraber, H. Newald:
"Miniaturized Giant Magneto-Impedance Reading Head for Magnetomechanical Bar-Code";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Szklarska Poreba, Poland;
08.06.1997
- 11.06.1997; in: "Proc. of ISSE 97",
(1997),
S. 152
- 156.
H. Hauser, J. Nicolics, A. Pohl:
"Magnetic Field Sensor by Giant Magneto-Impedance";
Vortrag: 16th IEEE Instrumentation & Measurement Technology Conference (IMTC 99),
Venice, Italy;
24.05.1999
- 26.05.1999; in: "Proc. of IMTC 99",
IEEE Catalog No. 99CH36309,
(1999),
ISBN: 0-7803-5276-9;
S. 275
- 278.
H. Hauser, J. Nicolics, R. Steindl, A. Pohl, C. Hausleitner:
"Giant Magneto-Impedance Magnetic Field Sensor with Surface Acoustic Wave Technology";
Vortrag: 13th European Conference on Solid-State Sensors, Actuators and Microsystems,
The Hague;
12.09.1999
- 15.09.1999; in: "Eurosensors XIII Abstracts (1999), S. 405 und Proc. of Eurosensors XIII",
EUROSENSORS XIII,
405
(1999),
ISBN: 90-76699-02-x;
S. 597
- 600.
H. Hauser, J. Steurer, M. Mündlein, I. Giouroudi, L. Musiejovsky, J. Zehetner, J. Nicolics:
"Laser Welding of GMI-Wire for Magnetic Field Sensors";
Vortrag: Informationstagung Mikroelektronik (ME),
Wien;
11.10.2006
- 12.10.2006; in: "Tagungsband Informationstagung Mikroelektronik 06",
(2006),
ISBN: 3-85133-040-4;
S. 86
- 92.
Z. Illyefalvi-Vitez, Z. Drozd, L. Golonka, A. Kikineshy, M. Kosek, P. Mach, J. Nicolics, W. Sauer, E. Shoikova, P. Svasta:
"International Local Network of Electronics Packaging Education";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Balatonfüred, Hungary;
06.05.2000
- 10.05.2000; in: "Proceedings",
(2000),
S. 171
- 179.
F. Keplinger, H. Hauser, J. Nicolics, C. Hausleitner, R. Steindl:
"Magnetic Field Sensor for Monitoring Tyre Wear";
Vortrag: int. Workshop on Wear Sensing 2002,
London (eingeladen);
05.12.2002; in: "Wear Sensing",
(2002).
G. Khatibi, B. Czerny, A. Lassnig, M. Lederer, J. Magnien, J. Nicolics, E. Suhir:
"A novel approach for evaluation of material interfaces in electronics";
Hauptvortrag: 2016 IEEE Aerospace Conference,
USA (eingeladen);
05.03.2016
- 12.03.2016; in: "IEEE Aerospace Conference Proceedings",
IEEE,
USA
(2016),
ISBN: 978-1-4673-7676-1;
S. 1
- 11.
G. Khatibi, B. Czerny, J. Magnien, M. Lederer, E. Suhir, J. Nicolics:
"Towards Adequate Qualification Testing of Electronic Products: Review and Extension";
Vortrag: IEEE Conference Publications,
Singapore (eingeladen);
03.12.2014
- 05.12.2014; in: "2014 IEEE 16th Electronics Packaging Technology Conference (EPTC 2014)",
IEEE,
(2014),
S. 1
- 6.
W. Kremser, J. Nicolics:
"Aspects of Thermal Design Optimization for Power Hybrid Circuits";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Göd, Hungary;
21.05.1996
- 25.05.1996; in: "Proceedings of the 1996 International Spring Seminar on Electronics Technology (ISSE 96)",
(1996),
S. 160
- 165.
W. Kremser, J. Nicolics:
"Thermal Aspects of Chip Bonding Techniques for Power Semiconductors";
Vortrag: International Conference on Microelectronics (MIEL),
Nova Gorica;
05.09.1996; in: "Proc. of 24th Int. Conf. on Microelectronics (MIEL 96)",
(1996),
S. 255
- 262.
P. Krivic, F. Wenzl, J. Nicolics:
"Investigation of Thermal Properties of Power LED Illumination Assemblies";
Poster: 35th International Spring Seminar on Electronics Technology (ISSE 2012),
Bad Aussee;
09.05.2012
- 13.05.2012; in: "Book of Abstracts",
(2012),
ISBN: 978-3-85465-015-7;
S. 36
- 37.
G. Langer, M. Leitgeb, J. Nicolics, M. Unger, H. Hoschopf, F. Wenzl:
"Advanced Thermal Management Solutions on PCBs for High Power Applications - Best Paper Award";
Vortrag: Ipc Apex Expo 2014,
Las Vegas, Nevada, USA;
25.03.2014
- 27.03.2014; in: "Proceedings",
(2014),
15 S.
M. Liedtke, G. Khatibi, B. Czerny, J. Nicolics:
"Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module";
Vortrag: 41st International Spring Seminar on Electronics Technology (ISSE),
Zlatibor;
16.05.2018
- 20.05.2018; in: "Book of Abstracts ISSE 2018",
IEEE,
(2018),
ISBN: 978-1-5386-5731-7;
S. 81
- 82.
A. Maric, I. Atassi, N. V. Blaz, G. Radosavljevic, L. Zivanov, H. Homolka, W. Smetana, J. Nicolics:
"Influence of Sintering Temperature on Complex Permeability of Ferritic LTCC in Wide Frequency Range";
Poster: ISSE 2011,
Tatranska Lomnica, Slovakia;
11.05.2011
- 13.05.2011; in: "Proceedings of the 34th International Spring Seminar on Electronics Technology",
IEEE Xplore,
(2011),
ISBN: 978-1-4577-2112-0;
S. 337
- 340.
M. Mayer, J. Nicolics, G. Hanreich, M. Mündlein:
"Thermal Aspects of GaAs Power FET Attachment Using Isotropically Conductive Adhesive";
Vortrag: 2nd Intern. IEEE Conf. on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002,
Zalaegerszeg, Hungary;
23.06.2002
- 26.06.2002; in: "Conference Proceedings Polytronic 2002",
(2002),
S. 38
- 43.
A. Mazloum Nejadari, G. Khatibi, M. Lederer, B. Czerny, J. Nicolics, L. Weiss:
"Reliability analysis of Cu wire bonds in microelectronic packages";
Hauptvortrag: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016,
Deutschland (eingeladen);
18.04.2016
- 20.04.2016; in: "17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",
IEEE,
Deutschland
(2016),
ISBN: 978-1-5090-2106-2;
Paper-Nr. 16,
8 S.
A. Mazloum Nejadari, M. Lederer, G. Khatibi, J. Nicolics:
"Crystal plasticity modeling of the heat affected zone of copper micro-wires";
Vortrag: European Microelectronics and Packaging Conference 2017 (EMPC),
Warsaw, Poland;
10.09.2017
- 13.09.2017; in: "Proceedings of the European Microelectronics and Packaging Conference EMPC",
(2017),
6 S.
A. Mazloum-Nejadari, M. Lederer, G. Khatibi, B. Czerny, L. Weiss, J. Nicolics:
"Investigation on the Lifetime of Copper Wire Bonds in Electronic Packages under Thermal and Mechanical Cyclic Loading";
Vortrag: 7th Electronic System-Integration Technology Conference (ESTC),
Dresden, Germany;
18.09.2018
- 21.09.2018; in: "Proceedings ESTC 2018",
(2018),
ISBN: 978-1-5386-6814-6;
7 S.
R. Medek, H. Hauser, J. Nicolics:
"Development of a Miniaturized Orthoferrite Based Optical Switch with Improved Electromagnetic Compatibility - First Results";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "Book of Abstracts of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 978-973-713-174-4;
S. 180
- 181.
R. Medek, J. Nicolics, P.L. Fulmek:
"Aperture Magnetooptical Switch - First Results with Labor Prototype";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Budapest, Hungary;
07.05.2008
- 11.05.2008; in: "Abstract Proceedings - Reliability and Life-time Prediction",
(2008),
ISBN: 978-963-06-4915-5;
S. 132
- 133.
R. Medek, J. Nicolics, H. Hauser:
"Recent Progresses on the Development of an Yttrium Orthoferrite Based Optical Switch";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "IEEE Proc. of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 1-4244-1218-8;
S. 361
- 366.
R. Medek, J. Nicolics, D. Schrottmayer:
"High Sensitive Pulse Industive Eddy Current Measurement For Mine Detection Systems";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 207
- 211.
G. Miskovic, M. D. Lukovic, M. V. Nikolic, Z. Z. Vasiljevic, J. Nicolics, O. S. Aleksic:
"Analysis of electronic properties of pseudobrookite thick films with possible application for gas sensors";
Vortrag: 39th International Spring Seminar on Electronics Technology (ISSE 2016),
Pilsen, Czech Republic;
18.05.2016
- 22.05.2016; in: "Proceedings ISSE 2016",
(2016),
ISBN: 978-1-5090-1389-0;
S. 386
- 391.
G. Miskovic, M. D. Lukovic, M. V. Nikolic, Z. Z. Vasiljevic, J. Nicolics, O. S. Aleksic:
"Possible Nitrogen Oxide and Carbon Monoxide Gas Sensing Using Pseudobrookite Thick Films";
Vortrag: 40th International Spring Seminar on Electronics Technology - ISSE 2017,
Sofia, Bulgarien;
11.05.2017
- 14.05.2017; in: "IEEE Proc. of ISSE 2017",
(2017),
ISBN: 978-1-5386-0582-0;
Paper-Nr. A06,
2 S.
G. Miskovic, M. V. Nikolic, M. D. Lukovic, Z. Z. Vasiljevic, J. Nicolics, O. S. Aleksic:
"Pseudobrookite thick films for potential application as low-temperature sensitive material in NO gas sensors";
Vortrag: 40th International Spring Seminar on Electronics Technology - ISSE 2017,
Sofia, Bulgarien;
11.05.2017
- 14.05.2017; in: "IEEE Proc. of ISSE 2017",
(2017),
ISBN: 978-1-5386-0582-0;
6 S.
J. Morris, J. Nicolics:
"Research Student Exchange Consortium Proposal";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 1
- 6.
M. Mündlein, A. Brunner, R. Chabicovsky, G. Stangl, J. Nicolics:
"A New Interconnection Technique for the Attachment of Sensors";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 277
- 281.
M. Mündlein, A. Brunner, R. Chabicovsky, G. Stangl, J. Nicolics:
"Innovative Verbindungstechnik für einen Miniaturisierten Hautfeuchtesensor";
Vortrag: Informationstagung Mikroelektronik (ME),
Wien, Ö;
10.10.2001
- 11.10.2001; in: "Beiträge der Informationstagung ME01",
D. Donhoffer, G. Fiedler (Hrg.);
(2001),
ISBN: 3-85133-022-6;
S. 225
- 230.
M. Mündlein, A. Brunner, J. Nicolics, R. Chabicovsky, N. Sekiguchi, T. Suzuki:
"Prototype of a Skin Humidity Sensor and Initial Experiments";
Vortrag: 25th International Spring Seminar on Electronics Technology,
Prague, Czech Republic;
11.05.2002
- 14.05.2002; in: "Proceedings ISSE 2002",
(2002),
S. 95
- 99.
M. Mündlein, R. Chabicovsky, J. Nicolics, B. Valentin, P. Svasek, E. Svasek, T. Komeda, H. Funakubo, T. Nagashima, M. Ito:
"Microsensor for the Measurement of the Transepidermal Water Loss of Human Skin";
Poster: GMe Forum 2005,
Vienna, Austria;
17.03.2005
- 18.03.2005; in: "Proceedings of the Seminar GMe Forum 2005",
K. Riedling (Hrg.);
(2005),
ISBN: 3-901578-15-3;
4 S.
M. Mündlein, R. Chabicovsky, J. Nicolics, B. Valentin, P. Svasek, E. Svasek, T. Komeda, H. Funakubo, T. Nagashima, T. Itoh:
"Mikrosensor zur Bestimmung des Transepidermalen Wasserverlustes der Menschlichen Haut";
Poster: Mikroelektronik 2003 (ME 2003),
Wien, Ö;
01.10.2003
- 02.10.2003; in: "Tagungsband Mikroelektronik 2003",
(2003),
ISBN: 3-85133-030-7;
S. 349
- 354.
M. Mündlein, M. Fasching, J. Nicolics:
"Optimization of Thermal Performance of D2PAK-SMD Assemblies for High-Temperature Applications";
Vortrag: FH Vorarlberg Symposium Mikrosystemtechnik für die Industrie,
Dornbirn;
30.05.2006
- 31.05.2006; in: "Dornbirner Mikrotechniktage 2006 - Technologie, Verfahren und Anwendungen der Mikrotechnik",
(2006),
S. 1
- 3.
M. Mündlein, G. Hanreich, J. Nicolics:
"Application of an ICA for the Production of a Radiation Sensor";
Vortrag: 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2003),
Montreux, Switzerland;
21.10.2003
- 23.10.2003; in: "Proceedings of the 3rd Intern. IEEE Conference Polytronic 2003",
(2003),
S. 123
- 127.
M. Mündlein, G. Hanreich, J. Nicolics:
"Simulation of the Aging Behavior of Isotropic Conductive Adhesives";
Vortrag: 2nd Intern. IEEE Conf. on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002,
Zalaegerszeg, Hungary;
23.06.2002
- 26.06.2002; in: "Conference Proceedings Polytronic 2002",
(2002),
S. 68
- 72.
M. Mündlein, H. Hauser, J. Nicolics, R. Chabicovsky:
"Partial Discharge Current Measurement in High Permittivity Dielectrics and their Meaning for Quality Control";
Poster: 26th International Spring Seminar on Electronics Technology,
Stará Lesná, Slovak Republic;
08.05.2003
- 11.05.2003; in: "Proceedings ISSE 2003",
(2003),
ISBN: 0-7803-8002-9;
S. 438
- 443.
M. Mündlein, J. Nicolics:
"Electrical Resistance Modeling of Isotropically Conductive Adhesive Joints";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Wiener Neustadt;
19.05.2005
- 22.05.2005; in: "Proc. of. 28th Int. Spring Seminar on Electronics Technology",
(2005),
ISBN: 0-7803-9325-2;
S. 144
- 149.
M. Mündlein, J. Nicolics:
"Modeling of particle arrangement in an isotropically conductive adhesive joint";
Vortrag: IEEE International Conference on Polymers & Adhesives (Polytronic),
Portland, Oregon, USA;
12.09.2004
- 15.09.2004; in: "Conference Proceedings Polytronic 2004",
(2004),
ISBN: 0-7803-8744-9;
S. PP3-1
- PP3-6.
M. Mündlein, J. Nicolics:
"Simulating the Contact Formation in Isotropically conductive Adhesives";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Wr. Neustadt, Austria;
19.05.2005
- 22.05.2005; in: "Book of Abstracts - 28th ISSE 2005",
(2005),
ISBN: 3-85133-036-6;
S. 100
- 101.
M. Mündlein, J. Nicolics, Martin Brandl:
"Multichipmodul in Feinstleiter-Ätztechnik";
Vortrag: Elektronische Baugruppen - Aufbau- und Fertigungstechnik,
Fellbach;
04.02.2004
- 05.02.2004; in: "GMM-Fachbericht: Elektronische Baugruppen",
44
(2004),
ISBN: 3-8007-2813-3;
S. 511
- 516.
M. Mündlein, J. Nicolics, Martin Brandl:
"Packaging Concept for a Miniaturized Wirelessly Interrogable Temperature Logger";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Banya, Bulgaria;
13.05.2004
- 16.05.2004; in: "Conference Proceedings ISSE 2004",
Book 1
(2004),
ISBN: 0-7803-8422-9;
S. 68
- 73.
M. Mündlein, J. Nicolics, R. Chabicovsky, N. Sekiguchi, T. Komeda, H. Funakubo, G. Stangl:
"Innovative Packaging Concept of a Miniaturized Skin Moisture Sensor and First Measuing Results";
Vortrag: EMBEC'02 2nd European Medical & Biological Engineering Conference,
Vienna, Austria;
04.12.2002
- 08.12.2002; in: "Proceedings Part II",
H. Hutten, P. Krösl (Hrg.);
(2002),
S. 968
- 969.
M. Mündlein, J. Nicolics, R. Chabicovsky, P. Svasek, E. Svasek, T. Komeda, H. Funakubo, T. Nagashima, M. Ito:
"Packaging of a thin film sensor for transepidermal water loss measurements";
Vortrag: 26th International Spring Seminar on Electronics Technology,
Stará Lesná, Slovak Republic;
08.05.2003
- 11.05.2003; in: "Proceedings ISSE 2003",
(2003),
ISBN: 0-7803-8002-9;
S. 328
- 333.
M. Mündlein, J. Nicolics, E. Gehberger, H. Hainzl:
"Conductive adhesive - an alternative to solder in SMT";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Calimanesti - Caciulata, Romania;
05.05.2001
- 09.05.2001; in: "Conference Proceedings ISSE 01",
(2001),
ISBN: 0-7803-7111-9;
S. 20
- 20.
M. Mündlein, J. Nicolics, E. Gehberger, H. Hainzl:
"Leitfähige Kleber - Eine Alternative zu Lot in der Oberflächenmontagetechnik";
Vortrag: Informationstagung Mikroelektronik (ME),
Wien, Ö;
10.10.2001
- 11.10.2001; in: "Beiträge der Informationstagung ME01",
D. Donhoffer, G. Fiedler (Hrg.);
ÖVE-Schriftenreihe,
26
(2001),
ISBN: 3-85133-022-6;
S. 271
- 276.
M. Mündlein, J. Nicolics, E. Gehberger, H. Hainzl:
"Leitfähige Kleber - Eine Alternative zu Lot in der Oberflächenmontagetechnik";
Vortrag: 10. TEClab Technologietag,
Korneuburg, Ö;
27.06.2001; in: "Innovative Verbindungstechniken",
R. Bonifert (Hrg.);
(2001),
ISBN: 3-902204-00-1;
S. 58
- 63.
M. Mündlein, J. Nicolics, H. Hainzl, E. Gehberger:
"Innovative Verbindungstechnik - Bleifreies Löten Leitkleben";
Vortrag: Mikroelektronik 2003 (ME 2003),
Wien, Ö;
01.10.2003
- 02.10.2003; in: "Tagungsband Mikroelektronik 2003",
(2003),
ISBN: 3-85133-030-7;
S. 437
- 442.
M. Mündlein, J. Nicolics, G. Hanreich:
"Accelerated Curing of Isotropically Conductive Adhesives by Vapor Phase Heating";
Vortrag: 3rd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2003),
Montreux, Switzerland;
21.10.2003
- 23.10.2003; in: "Proceedings of the 3rd International IEEE Conference Polytronic 2003",
(2003),
S. 101
- 105.
M. Mündlein, J. Nicolics, J. Morris:
"Reliability Investigations of Isotropic Conductive Adhesives";
Vortrag: 25th International Spring Seminar on Electronics Technology,
Prague, Czech Republic;
11.05.2002
- 14.05.2002; in: "Proceedings ISSE 2002",
(2002),
S. 329
- 333.
M. Mündlein, B. Valentin, R. Chabicovsky, J. Nicolics, J. Weremczuk, G. Tarapata, R. Jachowicz:
"Transepidermal Water Loss (TEWL) Measurements with Two Novel Sensors Based on Different Sensing Priciples";
Poster: EUROSENSORS XX,
Göteborg, Schweden;
17.09.2006
- 20.09.2006; in: "Proceedings EUROSENSORS 2006",
Vol. I
(2006),
ISBN: 91-631-9280-2;
S. 348
- 349.
L. Musiejovsky, J. Nicolics, H. Hauser, G. Brasseur:
"Thermal Performance of Plastic-Encapsulated and Hermetically Sealed Components for Automotive Applications";
Poster: IEEE Instrumentation and Measurement Technology Conference (IMTC 98),
St. Paul, USA;
18.05.1998
- 21.05.1998; in: "Proc. of IMTC 98",
IEEE Catalog,
98CH3622
(1998),
ISBN: 0-7803-4797-8;
S. 1185
- 1188.
L. Musiejovsky, J. Nicolics, H. Schrottmayer:
"Thermal Simulation of a Laser Soldering Process for the Attachment of Fine-Pitch Components";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Göd, Hungary;
21.05.1996
- 25.05.1996; in: "Proceedings of the 1996 International Spring Seminar on Electronics Technology (ISSE 96)",
(1996),
S. 240
- 247.
L. Musiejovsky, H. Schrottmayer, J. Nicolics:
"Solid-Solder Technology for Laser Soldering - An Alternative to Solder Pastes";
Vortrag: 5th Int. Conf. on Brazing, High Temperature Brazing and Diffusion Bonding (LÖT 98),
Aachen, BRD;
05.06.1998; in: "DVS Proc. of 5th Int. Conf. on Brazing, High Temperature Brazing and Diffusion Bonding",
(1998),
S. 278
- 282.
Zusätzliche Informationen
B. Nagl, B. Czerny, M. Lederer, G. Khatibi, M. Thoben, J. Nicolics:
"Electro-Thermal Analysis of In Situ Vibration Measurements on IGBT Modules under Operation Conditions";
Poster: 4th IEEE Electronics Systemintegration Technology Conference ESTC 2012,
Amsterdam, the Netherlands;
17.09.2012
- 20.09.2012; in: "Conference Proceedings",
(2012),
S. 1
- 6.
B. Nagl, B. Czerny, M. Lederer, G. Khatibi, M. Thoben, J. Nicolics:
"Experimental Investigation of Transient Electrical, Thermal and Mechanical Behavior of IGBT Inverter Modules during Operation";
Poster: ISPSD 2013 - 25th International Symposium on Power Semiconductor Devices & ICs,
Kanazawa, Japan;
26.05.2013
- 30.05.2013; in: "IEEE Xplore",
(2013),
S. 293
- 296.
B. Nagl, J. Nicolics:
"Analyses of thermo mechanically related failures of traction IGBT power modules at short circuit switching";
Poster: 3rd Electronics System Integration Technology Conference, ESTC 2010, Berlin,
Berlin;
13.09.2010
- 16.09.2010; in: "Book of Abstracts",
(2010).
B. Nagl, J. Nicolics, E. Suhir, W. Gschohsmann:
"Thermomechanical Consideration of Stress and Strain of a Thick-Wire Bond During Short-Circuit Load";
Vortrag: 35th International Spring Seminar on Electronics Technology (ISSE 2012),
Bad Aussee;
09.05.2012
- 13.05.2012; in: "Book of Abstracts",
(2012),
ISBN: 978-3-85465-015-7;
S. 116
- 117.
W. Nemitz, P.L. Fulmek, J. Nicolics, F. Wenzl:
"Determining the thermal load of phosphor converted LEDs by an iterative optical and thermal simulation procedure";
Vortrag: Optical Modeling and Performance Predictions VIII,
San Diego, CA, USA;
28.08.2016; in: "Proceedings",
Volume 9953
(2016),
S. 99530C-1.
W. Nemitz, C. Sommer, S. Schweitzer, P. Hartmann, P.L. Fulmek, J. Nicolics, F. Wenzl:
"Chromaticity coordinate maintenance of phosphor converted LEDs by a self-compensation approach";
Vortrag: 38th International Spring Seminar on Electronics Technology-ISSE 2015,
Eger, Hungary;
06.05.2015
- 10.05.2015; in: "Proceedings",
Budapest University of Technology and Economics,
(2015),
ISBN: 978-963-313-177-0;
S. 183
- 187.
W. Nemitz, F. Wenzl, S. Schweitzer, C. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics:
"A self-compensation approach for chromaticity coordinate maintenance of phosphor converted LEDs upon temperature variations";
Vortrag: 38th International Spring Seminar on Electronics Technology-ISSE 2015,
Eger, Hungary;
01.05.2015
- 02.05.2015; in: "Book of Abstracts",
Budapest University of Technology and Economics,
(2015),
ISBN: 978-963-313-177-0;
S. 98
- 99.
W. Nemitz, F. Wenzl, S. Schweitzer, C. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics:
"A self-compensation approach for maintaining the chromaticity coordinates of phosphor converted LEDs upon temperature variations";
Vortrag: LED professional Symposium + Expo 2014,
Bregenz, Austria;
30.09.2014
- 02.10.2014; in: "Proceedings of LED professional Symposium +Expo",
(2014),
S. 66
- 73.
J. Nicolics:
"Current Research Activities and Industry Cooperations at the Institut für Werkstoffe der Elektrotechnik";
Vortrag: 20th Conference on Hybrid Microelectronics (ISHM 96),
Jurata, Poland;
05.09.1996; in: "Proc. of 20th Conf. of the International Society for Hybrid Microelectronics, (ISHM 96)",
(1996),
S. 39
- 44.
Zusätzliche Informationen
J. Nicolics:
"New Materials, Developement of Technologies, and Applications";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Göd, Hungary;
21.05.1996
- 25.05.1996; in: "Proceedings of the 1996 International Spring Seminar on Electronics Technology (ISSE 96)",
(1996),
S. 8
- 13.
Zusätzliche Informationen
J. Nicolics:
"New Results from Research Activities and Industry Cooperations in the Field of Interconnection Technology";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Szklarska Poreba;
05.06.1997; in: "Proceedings of 20th Int. Spring Seminar on Electronics Technology (ISSE 97)",
(1997),
S. 66
- 71.
J. Nicolics, M. Franz, V. Deepak, G. Weichslberger:
"Influence of the Printed Circuit Board on the Assembly's Thermal Performance by the Example of Power LED based Lamp Prototypes";
Poster: 32nd International Spring Seminar on Electronics Technology (ISSE),
Brno, Czech Republic;
13.05.2009
- 17.05.2009; in: "ISSE 2009 Conference Proceedings",
(2009),
ISBN: 978-1-4244-4260-7;
S. 62
- 63.
J. Nicolics, M. Franz, V. Deepak, G. Weichslberger:
"Innovative Printed Circuit Board Technology for Heat Removal with Application to Power LED based Operating Room Lamps";
Vortrag: 32nd International Spring Seminar on Electronics Technology (ISSE),
Brno, Czech Republic;
13.05.2009
- 17.05.2009; in: "ISSE 2009 Conference Proceedings",
(2009),
ISBN: 978-1-4244-4260-7;
S. 13
- 17.
J. Nicolics, E. Gehberger, H. Hainzl, M. Mündlein:
"Isotrop leitfähige Kleber - eine Alternative zu Lot in der Oberflächenmontagetechnik";
Vortrag: Elektronische Baugruppen - Aufbau- und Fertigungstechnik,
Fellbach;
06.02.2002
- 07.02.2002; in: "GMM-Fachbericht: Elektronische Baugruppen",
(2002),
S. 375
- 381.
J. Nicolics, G. Hanreich, M. Fasching, W. Hachmeister, M. Mündlein:
"Laserlöten und -entlöten von Leadless Components";
Vortrag: Technologietag: Miniaturisierung in der Elektronik 2001,
Stockerau und Korneuburg, NÖ;
28.11.2001; in: "Miniaturisierung in der Elektronik",
R. Bonifert (Hrg.);
(2001),
ISBN: 3-902204-01-x;
S. 43
- 50.
J. Nicolics, G. Hanreich, G. Stangl:
"Investigation of the Thermal Performance of Micro-Whisker Structured Silicon Heatspreaders";
Vortrag: International Conference on Microelectronics (MIEL),
Nis, Yugoslavia;
14.05.2000
- 17.05.2000; in: "Proc. of IEEE",
IEEE Catalog,
No. 00TH8400
(2000),
S. 671
- 674.
Zusätzliche Informationen
J. Nicolics, W. Kremser:
"Investigation of the Steady State and Transient Thermal Properties of a PLCC Package";
Vortrag: 20th Conference on Hybrid Microelectronics (ISHM 96),
Jurata, Poland;
05.09.1996; in: "Proc. of 20th Conf. of the International Society for Hybrid Microelectronics, (ISHM 96)",
(1996),
S. 219
- 222.
J. Nicolics, W. Kremser:
"Transient Thermal Analysis of a PLCC Package Using the Finite Element Method";
Vortrag: XX ISHM Conference,
Jurata, Poland;
05.09.1996; in: "Abstracts Proc. of XX ISHM Conf.",
(1996),
S. 83
- 84.
J. Nicolics, P. Krivic, P.L. Fulmek, F. Wenzl, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, G. Langer:
"Thermal Issues of Phosphor Converted LEDs";
Vortrag: LED professional Symposium +Expo 2012,
Bregenz;
25.09.2012
- 27.09.2012; in: "LED Lighting Technologies, International Winning Approaches",
(2012),
ISBN: 978-3-9503209-4-7;
S. 22
- 27.
J. Nicolics, G. Langer, F. Lutschounig, K. Lang, R. Huber:
"Impact of Printed Circuit Board Technology on Thermal Performance of High-Power LED Assembly - Experimental Results";
Vortrag: 3rd Electronics System Integration Technology Conference, ESTC 2010, Berlin,
Berlin;
13.09.2010
- 16.09.2010; in: "Book of Abstracts",
(2010).
J. Nicolics, M. Mündlein, M. Fasching:
"Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
St. Marienthal, Germany;
10.05.2006
- 14.05.2006; in: "Proc. of. 29th Int. Spring Seminar on Electronics Technology",
(2006),
ISBN: 1-4244-0551-3;
S. 49
- 54.
J. Nicolics, M. Mündlein, G. Hanreich, M. Franz, A. Zluc, H. Stahr:
"Thermal Analysis of Embedded Carbon-Polymer Resistors in Multilayer Printed Circuit Boards";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "Book of Abstracts of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 978-973-713-174-4;
S. 50
- 51.
J. Nicolics, M. Mündlein, G. Hanreich, A. Zluc, H. Stahr, M. Franz:
"Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black-Polymer Resistors";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Cluj-Napoca, Romania;
09.05.2007
- 13.05.2007; in: "Proc. of 30th Int. Spring Seminar on Electronics Technology",
(2007),
ISBN: 1-4244-1218-8;
S. 46
- 52.
J. Nicolics, M. Mündlein, A. Jaturapiree:
"Electrically Conductive Adhesives - Recent Research Results and Specific Applications";
Vortrag: International Conference of IMAPS Poland Chapter,
Wroclaw, Poland;
26.09.2004
- 29.09.2004; in: "Proceedings of IMAPS 2004",
(2004),
S. 61
- 68.
J. Nicolics, L. Musiejovsky:
"Approximation Methods for Thermal Simulation of High-Lead Count Packages";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Göd, Hungary;
21.05.1996
- 25.05.1996; in: "Proceedings of the 1996 International Spring Seminar on Electronics Technology (ISSE 96)",
(1996),
S. 61
- 67.
J. Nicolics, L. Musiejovsky, G. Hanreich:
"Comparison of the Thermal Performance of Plastic-encapsulated and Hermetically Sealed Packages";
Vortrag: 3rd European Conference on Packaging Technology (EuPac 98),
Nuremberg, BRD;
05.06.1998; in: "DVS 191, Proc. of European Conference on Packaging Technology (EuPac 98)",
(1998),
S. 175
- 178.
Zusätzliche Informationen
J. Nicolics, L. Musiejovsky, M. Mündlein, H. Hauser, J. Zehetner:
"Laser Welding Process Optimization for the Production of Magnetic Field Sensors";
Poster: International Spring Seminar on Electronics Technology (ISSE),
St. Marienthal, Germany;
10.05.2006
- 14.05.2006; in: "Conference Program and Abstracts",
(2006),
ISBN: 3-934142-23-0;
S. 214
- 215.
J. Nicolics, L. Musiejovsky, M. Mündlein, J. Zehetner, J. Steurer, I. Giouroudi, H. Hauser:
"Laser Welding Process and Packaging for Magnetic Field Sensors";
Poster: International Spring Seminar on Electronics Technology (ISSE),
St. Marienthal, Germany;
10.05.2006
- 14.05.2006; in: "Proc. of. 29th Int. Spring Seminar on Electronics Technology",
(2006),
ISBN: 1-4244-0551-3;
S. 469
- 474.
J. Nicolics, W. Smetana, M. Fasching:
"Reliability aspects in solder joints of sealed casings for power applications";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Budapest, Hungary;
07.05.2008
- 11.05.2008; in: "Abstract Proceedings - Reliability and Life-time Predition",
(2008),
ISBN: 978-963-06-4915-5;
S. 50
- 51.
J. Nicolics, M. Unger, M. Morianz, H. Stahr, St. Groß:
"Thermal Characterization of a Pedelec 500W Motor Driver Module with Embedded Power Devices";
Vortrag: 40th International Spring Seminar on Electronics Technology - ISSE 2017,
Sofia, Bulgarien;
11.05.2017
- 14.05.2017; in: "IEEE Proc. of ISSE 2017",
(2017),
ISBN: 978-1-5386-0582-0;
Paper-Nr. B07,
6 S.
J. Nicolics, M. Weilguni, R. Medek, G. Langer, F. Lutschounig:
"Thermal Impedance Study of High-Power LED Flashlight Assembly";
Vortrag: 33rd International Spring Seminar on Electronics Technology (ISSE 2010),
Warsaw, Poland;
12.05.2010
- 16.05.2010; in: "Book of Abstracts",
(2010),
ISBN: 978-83-7207-874-2;
S. 49
- 50.
M. Recheis, J. Nicolics, H. Wegleiter, B. Schweighofer, P.L. Fulmek:
"Evaluation of Inductive Displacement Sensors for a Basic Active Magnetic Bearing Test Rig";
Poster: ISSE 2011,
Tatranska Lomnica, Slovakia;
11.05.2011
- 13.05.2011; in: "Proceedings of the 34th International Spring Seminar on Electronics Technology",
IEEE Xplore,
(2011),
ISBN: 978-1-4577-2112-0;
S. 626
- 631.
W. Rieder, H. Homolka, H. Hauser, J. Nicolics:
"Packaging Concepts of Electronic Heater Ignition Circuits for Switch Machines";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Balatonfüred, Hungary;
06.05.2000
- 10.05.2000; in: "ISSE 2000 Abstracts, S. O98",
ISSE 2000 Proceedings,
(2000),
ISBN: 963-420-639-5;
S. 442
- 444.
K. Riedling, J. Smejkal, J. Nicolics, E. Riedling:
"Remote Laboratory Classes on Components' Reliability";
Vortrag: 5th Intern. Academic Conference on Electronic Packaging, Education and Training,
Dresden, Germany;
20.03.2002
- 21.03.2002; in: "Proceedings of the 5th Int. Academic Conference on Electronic Packaging Education and Training",
R. Tummala, K.-J. Wolter, T. Zerna (Hrg.);
Verlag Dr. Markus A. Detert,
Templin/Uckermark
(2002),
ISBN: 3-934142-07-9;
S. 123
- 130.
Zusätzliche Informationen
H. Schrottmayer, L. Musiejovsky, J. Nicolics:
"A New Method for Measuring the Dynamic Wettability under Dip and Wave Soldering Conditions";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Neusiedl am See, Austria;
04.05.1998
- 07.05.1998; in: "Proc. of 21st International Spring Seminar on Electronics Technology (ISSE 98)",
Werkstoffe der Elektrotechnik,
Wien
(1998),
ISBN: 3-85465-004-3;
S. 249.
Zusätzliche Informationen
H. Schrottmayer, J. Nicolics:
"A New Experimental Method for Direct Determination of the Dynamic Wetting Behavior of SMDs";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Szklarska Poreba;
05.07.1997; in: "Proceedings of 20th Int. Spring Seminar on Electronics Technology (ISSE 97)",
(1997),
S. 229
- 235.
Zusätzliche Informationen
H. Schrottmayer, J. Nicolics:
"Automatische Qualitätssicherung während des Laserlötens von Fine-Pitch-Bauelementen";
Vortrag: Int. Hochschulkolloquium "Weichlöten in Forschung und Praxis",
München;
05.06.1996; in: "DVS 182 Tagungsband des Int. Koll. Weichlöten in Forschung und Praxis",
(1996),
S. 96
- 108.
S. Schweitzer, W. Nemitz, C. Sommer, P. Hartmann, P.L. Fulmek, J. Nicolics, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, F. Wenzl:
"The impact of individual materials parameters on color temperature reproducibility among phosphor converted LED sources";
Vortrag: SPIE - Optics and Photonics 2014,
San Diego, USA;
21.08.2014; in: "Proceedings of SPIE 2014",
(2014),
1 S.
S. Schweitzer, C. Sommer, P. Hartmann, W. Nemitz, P. Pachler, H. Hoschopf, G. Langer, P.L. Fulmek, J. Nicolics, F. Wenzl:
"The Impact Of The Silicone Encapsulation Layers On The White Light Quality Of Phosphor Converted Leds";
Vortrag: Twelfth International Conference on Solid State Lighting and Fourth International Conference on White LEDs and Solid State Lighting,
an Diego, California, USA;
12.08.2012; in: "Proceedings of SPIE 8484",
(2012),
8 S.
J. Silvano de Sousa, P.L. Fulmek, M. Unger, P. Haumer, J. Nicolics:
"Embedded Heat Pipes as Thermal Solution for PCBs";
Vortrag: ICEP 2017,
Tendo, Yamagata, Japan;
19.04.2017
- 22.04.2017; in: "Proceedings ICEP 2017",
(2017),
S. 394
- 398.
J. Silvano de Sousa, P.L. Fulmek, M. Unger, P. Haumer, J. Nicolics:
"Enhanced Heat Transport in Printed Circuit Boards via Passive Components Embedding";
Vortrag: IMAPS Nordic 2017 Conf. on Microelectronics Packaging,
Göteborg, Sweden;
01.05.2017
- 03.05.2017; in: "Conference Proceedings",
(2017),
ISBN: 978-1-5386-3054-9;
6 S.
J. Silvano de Sousa, P.L. Fulmek, M. Unger, P. Haumer, J. Nicolics, M. Abo Ras, D. May:
"Enhanced In-Plane Heat Transport in Embedded Mini Heat Pipes PCB";
Vortrag: 50th International Symposium on Microelectronics - IMAPS 2017,
Raleigh, NC USA;
09.10.2017
- 12.10.2017; in: "Proceedings IMAPS 2017",
(2017),
5 S.
J. Silvano de Sousa, S. Liebfahrt, B. Reitmaier, M. Prutti, B. Schuscha, T. Qi, J. Nicolics, M. Unger, P.L. Fulmek:
"Heat Capacitive PCB";
Vortrag: 7th Electronic System-Integration Technology Conference (ESTC),
Dresden, Germany;
18.09.2018
- 21.09.2018; in: "Proceedings ESTC 2018",
(2018),
ISBN: 978-1-5386-6814-6;
6 S.
J. Silvano de Sousa, M. Unger, P.L. Fulmek, P. Haumer, J. Nicolics:
"Embedded Mini Heat Pipes asThermal Solution for PCBs";
Vortrag: European Microelectronics and Packaging Conference 2017 (EMPC),
Warsaw, Poland;
10.09.2017
- 13.09.2017; in: "Proceedings of the European Microelectronics and Packaging Conference EMPC",
(2017),
2 S.
W. Smetana, B. Balluch, I. Atassi, J. Nicolics, E. Gaubitzer, G. Köhler, M. Edetsberger:
"Herstellung eines Monitoring-Moduls für Bio-Reaktionen in LTCC-Technologie";
Poster: Informationstagung Mikroelektronik 08 (ME2008),
Wien;
15.10.2008
- 16.10.2008; in: "Tagungsband zur Informationstagung Mikroelektronik 08",
(2008),
ISBN: 978-3-85133-049-6;
S. 78
- 81.
W. Smetana, R. Reicher, M. Mündlein, J. Nicolics, H. Homolka:
"Thick film initiator elements - an alternative to resistive wire initiators for automotive safety units";
Vortrag: 26th International Spring Seminar on Electronics Technology,
Stará Lesná, Slovak Republic;
08.05.2003
- 11.05.2003; in: "Proceedings of the ISSE 2003",
(2003),
ISBN: 0-7803-8002-9;
S. 433
- 437.
C. Sommer, P.L. Fulmek, J. Nicolics, S. Schweitzer, W. Nemitz, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, F. Wenzl:
"Thermal and Optical Aspects of Glob-Top Design for Phosphor Converted White LED Light Sources";
Poster: SPIE Optics + Photonics 2013,
San Diego, USA;
25.08.2013
- 29.08.2013; in: "Proc. of SPIE Vol. 8835",
(2013),
S. 1
- 8.
H. Stahr, M. Morianz, S. Gross, M. Unger, J. Nicolics, L. Böttcher:
"Investigation of a power module with double sided cooling using a new concept for chip embedding";
Vortrag: 9th Int. Conf. on Integrated Power Electronics Systems, CIPS 2016,
Nürnberg, Germany;
08.03.2016
- 10.03.2016; in: "Proceedings of CIPS 2016",
VDE Verlag GmbH Berlin,
(2016),
ISBN: 978-3-8007-4171-7;
10 S.
H. Stahr, M. Unger, J. Nicolics, M. Morianz, S. Gross, L. Böttcher:
"Thermal benchmark of a classic and novel embedded high-power 3-phase Inverter bridge";
Vortrag: 6th Electronics System-Integration Technology Conference, ESTC 2016,
Grenoble, France;
13.09.2016
- 16.09.2016; in: "Proceedings ESTC 2016",
(2016),
6 S.
E. Suhir, L. Bechou, J. Nicolics:
"Bow-free tri-Component assembly for aerospace optoelectronics applications: Predicted thermal stresses";
Vortrag: IEEE Aerospace Conference 2015,
Big Sky, Montana, USA;
07.03.2015
- 12.03.2015; in: "Proceedings of IEEE Aerospace Conference",
(2015),
ISBN: 978-1-4799-5379-0;
S. 1
- 10.
E. Suhir, L. Bechoub, A. Bensoussan, J. Nicolics:
"Photovoltaic Reliability Engineering: Qualification Testing and Probabilistic-Design-for-Reliability Concept";
Poster: SPIE Optics + Photonics 2013,
San Diego, California, USA (eingeladen);
25.08.2013
- 29.08.2013; in: "Proc. SPIE 8825",
(2013),
S. 1
- 14.
E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics:
"Probabilistic design for reliability in electronics and photonics: Role, significance, attributes";
Vortrag: Reliability Physics Symposium (IRPS), 2015 IEEE International,
Ca, USA;
19.04.2015
- 23.04.2015; in: "Reliability Physics Symposium (IRPS), 2015 IEEE International",
IEEE,
USA
(2015),
S. 1
- 13.
E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics:
"Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges";
Vortrag: IEEE International Reliability Physics Symposium (IRPS),
Waikoloa, HI, USA;
01.06.2014
- 05.06.2014; in: "Proceedings of IRPS 2014",
(2014),
13 S.
E. Suhir, A. Bensoussan, J. Nicolics:
"Bow-Free Tri-Component Mechanically Pre-Stressed Failure-Oriented-Accelerated-Test (FOAT) Specimen";
Vortrag: SAE Aero-Tech Conference,
Seatle, Washington, USA;
22.09.2015
- 24.09.2015; in: "Proceedings",
(2015),
9 S.
E. Suhir, R. Ghaffarian, L. Bechou, J. Nicolics:
"Column-Grid-Array (CGA) Technology Could Lead to a Highly Reliable Package Design";
Vortrag: IEEE Aerospace Conference 2016,
Big Sky, Montana, USA;
08.03.2016
- 10.03.2016; in: "Conference Proceedings",
(2016),
ISBN: 978-3-8007-4171-7;
Paper-Nr. 2006,
8 S.
E. Suhir, J. Nicolics:
"Aerospace electronics-and-photonics (AEP) reliability has to be quantified to be assured";
Vortrag: 18th AIAA Non-Deterministic Approaches Conference (AIAA SciTech 2016),
San Diego, CA, USA;
04.01.2016
- 08.01.2016; in: "Proceedings AIAA ScieTech 2016",
(2016),
S. 167901
- 167927.
E. Suhir, J. Nicolics:
"Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal Stresses";
Vortrag: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016),
Montpellier, France;
17.04.2016
- 20.04.2016; in: "Proceedings EuroSimE 2016",
(2016),
ISBN: 978-1-5090-2106-2;
Paper-Nr. 16,
9 S.
E. Suhir, J. Nicolics, L. Bechou:
"Aerospace Electronic and Photonic Packaging: Predicted Thermal Stresses in Bi- and Tri-Material Assemblies";
Vortrag: IEEE Aerospace Conference 2014,
Big Sky, Montana, USA;
01.03.2014
- 08.03.2014; in: "IEEE Proceedings",
(2014),
Paper-Nr. 2015,
12 S.
E. Suhir, J. Nicolics, L. Bechou:
"Predicted Thermal Stresses in a Bow-Free Electronic Assembly for Automotive and Potential Aerospace Applications";
Vortrag: IEEE Aerospace Conference 2016,
Big Sky, Montana, USA;
08.03.2016
- 10.03.2016; in: "Conference Proceedings",
(2016),
ISBN: 978-3-8007-4171-7;
10 S.
E. Suhir, J. Nicolics, G. Khatibi, M. Lederer:
"Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit Stresses";
Vortrag: International Conference MPPE 2015 - Materials, Processing and Product Engineering,
Leoben;
03.11.2015
- 05.11.2015; in: "2016 IOP Conf. Ser.: Mater. Sci. Eng",
IOP Conf. Series: Materials Science and Engineering,
119
(2016),
S. 1
- 11.
M. Unger, J. Nicolics:
"Discretisation and Data Reduction Algorithm for FE Modelling of Complex Multilayer PCBs with Embedded Components";
Vortrag: 41st International Spring Seminar on Electronics Technology, "Research and Development Tendencies in Advanced Electronics Technologies",
Zlatibor, Serbia;
16.05.2018
- 20.05.2018; in: "Book of Abstracts",
(2018),
ISBN: 9788660220426;
S. 122
- 123.
M. Unger, J. Nicolics, G. Langer, F. Wenzl, W. Nemitz, P.L. Fulmek, S. Schweitzer:
"Thermal Performance Study of Direct Attached High-Power LEDs using an Innovative Submount Technique";
Vortrag: Electronics System-Integration Technology Conference (ESTC 2014),
Helsinki, Finland;
16.09.2014
- 18.09.2014; in: "Proceedings ESTC 2014",
(2014),
S. 171
- 176.
M. Unger, J. Nicolics, G. Langer, F. Wenzl, W. Nemitz, P.L. Fulmek, S. Schweitzer:
"Thermal Performance Study of Direct Attached High-Power LEDs using an Innovative Submount Technique";
Vortrag: 37th International Spring Seminar on Electronics Technology,
Dresden;
07.05.2014
- 11.05.2014; in: "Proceedings of the 37th ISSE",
(2014),
ISBN: 978-1-4799-4026-4;
6 S.
M. Unger, J. Nicolics, M. Morianz, H. Stahr, F. Dosseul, D. Manessis:
"Thermomechanical comparison of novel embedded high-power packages using FEM-simulations";
Vortrag: IMAPS Nordic Conference 2015,
Helsingor, Denmark;
08.06.2015
- 09.06.2015; in: "Proceedings of IMAPS Nordic Conference 2015",
(2015),
S. 126
- 133.
M. Unger, J. Nicolics, H. Stahr, M. Morianz, F. Dosseul:
"Thermal Performance of Novel Diode Packages";
Vortrag: 39th International Spring Seminar on Electronics Technology (ISSE 2016),
Pilsen, Czech Republic;
18.05.2016
- 22.05.2016; in: "Extended Abstracts ISSE 2016",
(2016),
ISBN: 978-1-5090-1389-0;
S. 65
- 66.
M. Unger, H. Stahr, M. Morianz, J. Nicolics, F. Dosseul:
"Miniaturized Power-Diode Package with Superior Thermal Performance using Embedding Technology";
Vortrag: 39th International Spring Seminar on Electronics Technology (ISSE 2016),
Pilsen, Czech Republic;
18.05.2016
- 22.05.2016; in: "Proceedings ISSE 2016",
(2016),
ISBN: 978-1-5090-1389-0;
S. 97
- 105.
B. Valentin, M. Mündlein, R. Chabicovsky, J. Nicolics:
"Evaluation of a Novel Transepidermal Water Loss Sensor";
Vortrag: 3rd IEEE Conference on Sensors (IEEE Sensors 2004),
Vienna, Austria;
24.10.2004
- 27.10.2004; in: "CD-ROM Proceedings Sensor 2004",
D. Rocha Wiese Meneses, P. Sarro, M. Vellekoop (Hrg.);
(2004),
ISBN: 0-7803-8692-2;
S. 115
- 118.
B. Valentin, M. Mündlein, R. Chabicovsky, J. Nicolics:
"Novel Microsensor for the Measurement of the Transepidermal Water Loss of Human Skin";
Vortrag: 12th International Conference (Sensors 2005),
Nuremberg, Germany;
10.05.2005
- 12.05.2005; in: "Proceedings Volume I",
(2005),
S. 173
- 178.
B. Valentin, M. Mündlein, R. Chabicovsky, J. Nicolics:
"Thin Film Sensor for Transepidermal Water Loss Measurement - Calibration Method and Application to Human Skin";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Wr. Neustadt, Austria;
19.05.2005
- 22.05.2005; in: "Proceedings of 28th ISSE 2005",
(2005),
ISBN: 0-7803-9325-2;
S. 64
- 68.
B. Valentin, M. Mündlein, J. Nicolics, R. Chabicovsky:
"Calibration of a Thin Film Sensor for Transepidermal Water Loss Measurement";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Wr. Neustadt, Austria;
19.05.2005
- 22.05.2005; in: "Book of Abstracts - 28th ISSE 2005",
(2005),
S. 84
- 85.
M. Weilguni, I. Atassi, W. Gschohsmann, W. Smetana, J. Nicolics, W. Goebl:
"An Analytical Model for a Two-Layer LTCC Beam";
Vortrag: ISSE 2011,
Tatranska Lomnica, Slovakia;
11.05.2011
- 13.05.2011; in: "Proceedings of the 34th International Spring Seminar on Electronics Technology",
IEEE Xplore,
(2011),
ISBN: 978-1-4577-2112-0;
S. 481
- 485.
M. Weilguni, W. Smetana, A. Hofmann, G. Radosavljevic, W. Goebl, J. Nicolics:
"A ring-shaped LTCC/HTCC sensor for detection of finger forces in clarinet playing";
Poster: IEEE Sensors 2012,
Taipei, Taiwan;
28.10.2012
- 31.10.2012; in: "Conference Proceedings",
(2012),
ISBN: 978-1-4577-1767-3;
S. 1116
- 1119.
M. Weilguni, W. Smetana, G. Radosavljevic, J. Nicolics, W. Goebl, A. Hofmann:
"Low Temperature Co-fired Ceramics Processing Parameters Governing the Performance of Miniaturized Force Sensor";
Poster: IMAPS/ACerS 8th International CICMT Conference and Exhibition (2012),
Erfurt, D;
16.04.2012
- 19.04.2012; in: "Proc. of 8th Conf. and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technology (CICMT)",
(2012),
S. 411
- 416.
F. Wenzl, P.L. Fulmek, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, J. Nicolics:
"The impact of the color conversion element configuration on its thermal response in phosphor converted LEDs";
Poster: SPIE Optics + Photonics 2013,
San Diego, California, USA;
25.08.2013
- 29.08.2013; in: "Proc. of SPIE Vol. 8835",
(2013),
S. 1
- 8.
F. Wenzl, W. Nemitz, L. Kuna, C. Sommer, P.L. Fulmek, J. Nicolics, P. Pachler, H. Hoschopf, F. Schrank, G. Langer, P. Hartmann:
"Foil based optical elements for beam shaping and color homogenization of phosphor converted white LED sources";
Vortrag: SPIE - Optics and Photonics 2014,
San Diego, USA;
21.08.2014; in: "Proceedings of SPIE 2014",
(2014),
1 S.
F. Wenzl, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, G. Langer, P.L. Fulmek, J. Nicolics:
"White light quality of phosphor converted leds from a phosphor materials perspective of view: an Evaluation based on combined thermal and optical simulations";
Vortrag: Twelfth International Conference on Solid State Lighting and Fourth International Conference on White LEDs and Solid State Lighting,
an Diego, California, USA (eingeladen);
12.08.2012; in: "Proceedings of SPIE 8484",
(2012).
F. Wenzl, C. Sommer, P. Hartmann, P. Pachler, H. Hoschopf, G. Langer, P.L. Fulmek, J. Nicolics:
"White light quality of phosphor converted light‐emitting diodes from a materials perspective of view";
Vortrag: 2nd European Energy Conference,
Maastricht, the Netherlands;
17.04.2012
- 20.04.2012; in: "Conference Proceedings",
(2012),
S. 1.
J. Wissenwasser, M. Vellekoop, J. Nicolics:
"Silicone-based Encapsulation of a Cell Culture Measurement Device under Physiological Conditions";
Poster: 32nd International Spring Seminar on Electronics Technology (ISSE),
Brno, Czech Republic;
13.05.2009
- 17.05.2009; in: "ISSE 2009 Conference Proceedings",
(2009),
ISBN: 978-1-4244-4260-7;
S. 126
- 127.
T. Zawada, A. Dziedzic, L. Golonka, G. Hanreich, J. Nicolics:
"Temperature Field Analysis in a Low Temperature Cofire Ceramic Microsystem";
Poster: European Microelectronics, Packaging and Interconnection Symposium (IMAPS 2000),
Prag, Czech Republic;
18.06.2000
- 20.06.2000; in: "Symposium Proceedings",
(2000),
S. 388
- 393.
J. Zehetner, G. Langer, M. Riester, M. Mündlein, J. Nicolics, R. Houbertz:
"Thermal Analyses of a Multilayer with Embeded Vertical-Cavity Surface Emitting Lasers";
Vortrag: IEEE International Conference on Polymers & Adhesives (Polytronic),
Tokyo, japan;
15.01.2007
- 18.01.2007; in: "Proceedings Polytronic 2007",
(2007),
S. 245
- 250.
S. Zoppel, St. Partl, J. Nicolics, G.A. Reider, J. Zehetner:
"Laserablation und ihre Anwendung in der Mikrotechnik";
Vortrag: FH Vorarlberg Symposium Mikrosystemtechnik für die Industrie,
Dornbirn;
30.05.2006
- 31.05.2006; in: "Dornbirner Mikrotage 2006 - Technologie, Verfahren und Anwendungen der Mikrotechnik",
(2006),
S. 20
- 24.
S. Zoppel, J. Zehetner, L. Musiejovsky, H. Hauser, J. Nicolics:
"Laser Micromachining for GMI-Sensors";
Poster: European Magnetic Sensors & Actuators Conference,
Bilbao, Spanien;
03.07.2006
- 05.07.2006; in: "Book of Abstracts",
(2006),
S. 147.
Vorträge und Posterpräsentationen (ohne Tagungsband-Eintrag)
R. Chabicovsky, J. Nicolics:
"Dünnschicht-Thermoelemente aus W-NiCr für die thermische Analyse eines Laser-Lötprozesses";
Poster: Fachtagung Miniaturisierung durch Mikrosystemtechnik (Sensorik, Aktorik, Mikromechanik),
Wien, Austria;
05.05.1997.
R. Chabicovsky, J. Nicolics:
"Interconnection of Thin-Film Sensors with Laser";
Vortrag: Wifi und FFF-Fachtagung für Mikrosystemtechnik,
Wien;
05.05.1997.
Z. Goekdeniz, G. Khatibi, J. Nicolics:
"Fatigue behavior of Ag-sintered joints";
Vortrag: 29th Colloquium on Fatigue Mechanisms,
Brno, Czech Republic;
21.03.2019
- 22.03.2019.
Z. Goekdeniz, G. Khatibi, J. Nicolics:
"Fatigue Behavior of Sintered Cu-Ag-Cu Lap-joints";
Poster: Infineon InnoWeek 2019 Regensburg,
Regensburg;
25.06.2019
- 27.06.2019.
Z. Goekdeniz, G. Khatibi, J. Nicolics:
"Influence of Temperature on Mechanical Fatigue of Sintered Cu-Ag-Cu Joints";
Poster: Infineon InnoWeek Campeon München,
München;
24.10.2019
- 25.10.2019.
G. Hanreich, J. Nicolics:
"Laserentlöten von Leadless Packages";
Vortrag: Elektroniktechnologie-Kolloquium,
Wien, Ö (eingeladen);
29.06.2001.
Z. Illyefalvi-Vitez, L. Golonka, P. Mach, J. Nicolics, P. Svasta:
"Networking the Electronics Packaging Education";
Vortrag: 50th Electronic Components and Technology Conf. ECTE,
Las Vegas;
21.05.2000
- 24.05.2000.
G. Miskovic, O. S. Aleksic, M. Nikolic, J. Nicolics, G. Radosavljevic, Z. Z. Vasiljevic, M. D. Lukovic:
"Nanostructured SnO2 thick films for gas sensor application: analysis of structural and electronic properties";
Vortrag: 5th International Conference on Materials and Applications for Sensors and Transducers (IC-MAST 2015),
Mykonos Island, Greece;
27.09.2015
- 30.09.2015.
J. Nicolics:
"A New Method for Measuring the Dynamic Wettability under Dip and Wave Soldering Conditions";
Vortrag: Technisches Know-how für die Wiener Wirtschaft,
WIFI Wien;
05.06.1998.
J. Nicolics:
"Advanced LED Modules and Light Engines for Professional Lighting";
Vortrag: Joanneum Research,
Weiz (eingeladen);
31.03.2010.
J. Nicolics:
"Board on Board Technology EURIPIDES Project BoB EUR-10-101";
Vortrag: Forschungskooperations-Meeting Thales,
Colombes, Frankreich (eingeladen);
21.09.2010.
J. Nicolics:
"Comparison of the Thermal Performance of Plastic and Ceramic Packages";
Poster: Int. Workshop on Components off the Shelf (COTS),
Arcachon;
05.10.1997.
J. Nicolics:
"Entwärmung durch innovative Leiterplattentechnologie am Beispiel eines Operations-scheinwerfers auf LED-Basis";
Vortrag: 6. AT&S-Technologieforum,
Leoben-Hinterberg;
21.04.2009.
J. Nicolics:
"Gegenüberstellung von Messungen mit zwei High-End-Thermographie-Systemen mit unterschiedlicher spektraler Sensitivität am Beispiel der thermischen Untersuchung von Sensor-Heizelementen";
Vortrag: Thermografie-Forum,
Eugendorf (eingeladen);
07.09.2012
- 08.09.2012.
J. Nicolics:
"hermal Management - Solutions for Power LEDs by Cooperative Research";
Vortrag: AT&S-Klagenfurt,
Klagenfurt;
01.12.2009.
J. Nicolics:
"hermisch-optimiertes PCB-Design für neue LED Packages, Vorstellung erster Simulationsergebnisse, Vorstellung der Forschungsergebnisse von TU Wien";
Vortrag: OSRAM Workshop,
Regensburg, D;
18.03.2009.
J. Nicolics:
"Interconnection Techniques for Sensors - A Review of Research Activities and Industry Cooperations";
Poster: International Spring Seminar on Electronics Technology (ISSE),
Szklarska Poreba;
05.06.1997.
J. Nicolics:
"Laserlöten";
Vortrag: Zentrum für mikrotechnische Produktion,
TU-Dresden (eingeladen);
28.04.1997.
J. Nicolics:
"LTCC technology, electronic packaging, thermal managment";
Vortrag: Eureka IPCTECH Kick-off Meeting,
Vienna, Austria (eingeladen);
06.04.2010
- 07.04.2010.
J. Nicolics:
"Overview of the department's activities and proposed contributions to thermal management for Board-on-Board Technology";
Vortrag: Partner-Evaluierung von Thales, Colombes, Frankreich für die Aufnahme in ein Partnerkonsortium eines Forschungsprojekts mit Eureka-Label,
Vienna (eingeladen);
25.11.2010.
J. Nicolics:
"Packaging";
Vortrag: Technisches Know-how für die Wiener Wirtschaft,
WIFI Wien;
05.06.1998.
J. Nicolics:
"Power-LED-basierte Operationsleuchten - Thermal Management";
Vortrag: AT&S-Klagenfurt,
Klagenfurt;
28.01.2009.
J. Nicolics:
"Simulation des thermischen Verhaltens integrierter Halbleiterbauelemente";
Vortrag: Fachvortrag zur Anbahnung einer Kooperation,
AMS, Schloß Premstätten (eingeladen);
25.03.1997.
J. Nicolics:
"Thermal Management - Messung und Simulationsmethoden - und Anwendung auf PCBs mit embedded High-Power-LEDs";
Vortrag: Joanneum Research,
Weiz (eingeladen);
21.10.2010.
J. Nicolics:
"Thermal Management with Application to High Power LED Lamps";
Vortrag: 4M Workshop "Devices for Harsh Environmental Applications",
Vienna;
08.06.2009.
J. Nicolics:
"Thermisches Management in der Elektronik";
Hauptvortrag: 14. Europäisches Elektroniktechnologie-Kolleg,
Colonia de Sant Jordi, Mallorca (eingeladen);
16.03.2011
- 20.03.2011.
J. Nicolics:
"Thermographie zur Qualitätssicherung bei der LED-Fertigung und Messung der Wärmeleitfähigkeit von Kunststoff-Folien";
Vortrag: Forschungskooperations-Meeting Tridonic GmbH,
Jennersdorf, Austria (eingeladen);
16.12.2010.
J. Nicolics:
"Über den dynamischen Benetzungsprozeß und seine Nutzung zur Qualitätssicherung beim Laserlöten";
Vortrag: Habilitationskolloquium, TU-Wien,
TU-Wien;
19.03.1997.
J. Nicolics, R. Chabicovsky:
"Einsatz des Lasers für die Montage von Sensoren";
Vortrag: Graduierten Kolleg Sensorik,
Dresden, Germany (eingeladen);
30.04.1997.
N. Sekiguchi, T. Komeda, H. Funakubo, R. Chabicovsky, J. Nicolics, G. Stangl:
"Microsensor for the Measurement of Water Content in the Human Skin";
Vortrag: 14th European Conference on Solid-State Transducers (Eurosensors 2000),
Copenhagen, Denmark;
27.08.2000
- 30.08.2000.
Patente
H. Hauser, J. Nicolics:
"Magnetfeldsensor aus dünnen Drähten";
Patent: Österreich,
Nr. AT 405.984;
eingereicht: 26.02.1997,
erteilt: 15.05.1999.
H. Hauser, J. Nicolics, H. Bruggraber, H. Newald:
"Verfahren zur Herstellung eines Magnetfeldsensors und nach diesem Verfahren hergestellter Sensor";
Patent: Europa,
Nr. EP 0 862 064 A2;
eingereicht: 12.02.1998.
Zusätzliche Informationen
H. Hauser, J. Nicolics, H. Bruggraber, H. Newald:
"Verfahren zur Herstellung eines Magnetfeldsensors und nach diesem Verfahren hergestellter Sensor";
Patent: Österreich,
Nr. A 183/98;
eingereicht: 03.02.1998.
Zusätzliche Informationen
H. Hauser, J. Nicolics, H. Newald, H. Bruggraber:
"Method of Producing a Magnetic Field Sensor and Sensor Produced by the Method";
Patent: USA,
Nr. 6,111.407;
eingereicht: 17.01.1998,
erteilt: 29.08.2000.
Habilitationsschriften
J. Nicolics:
"Über den dynamischen Benetzungsprozeß und seine Nutzung zur Qualitätssicherung beim Laserlöten";
Technische Universität Wien, Fakultät für Elektrotechnik,
1997.
Dissertationen (eigene und begutachtete)
A. Aghzout:
"Über die Leitfähigkeit von elektrisch anisotropen Klebern und deren Anwendungen in der Mikroelektronik";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics;
Institut für Industrielle Elektronik und Materialwissenschaften,
2002.
B. Böhme:
"Beiträge zur viskoelastischen Charakterisierung polymerer Werkstoffe der Aufbau- und Verbindungstechnik der Elektronik";
Betreuer/in(nen), Begutachter/in(nen): K.-J. Wolter, J. Nicolics;
Technische Universität Dresden,
2011.
J. Bohm:
"InduLIT: Induktiv angeregte Lock-in-Thermografie zur zerstörungsfreien Funktionsprüfung in der Elektrotechnik";
Betreuer/in(nen), Begutachter/in(nen): K. Wolter, J. Nicolics;
Fakultät Eletrotechnik und Informationstechnik der Techn. Universität Dresden,
2014;
Rigorosum: 02.12.2014.
T. Ewald:
"Untersuchungen zum Mechanismus der Porenentstehung in Weichlot¬verbindungen beim Reflowlöten";
Betreuer/in(nen), Begutachter/in(nen): K. Wolter, J. Nicolics;
Technische Universität Dresden,
2013;
Rigorosum: 15.05.2013.
W. Gschohsmann:
"Untersuchungen an bleifreien Lötverbindungen als Grundlage zur verbesserten Modellbildung und zur Steigerung der Lötstellenqualität";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, J. Wernisch;
Institut für Industrielle Elektronik und Materialwissenschaften,
2003.
M. Gusenbauer:
"Tunable microfluidic chips for isolating circulating tumor cells";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, T. Schrefl;
E366,
2013;
Rigorosum: 21.10.2013.
G. Hanreich:
"Simulation dynamischer Wärmeübergangsvorgänge in der Aufbau- und Verbindungstechnik";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, K.-J. Wolter;
Institut für Sensor- und Aktuatorsysteme,
2004.
P. Krivic:
"Low-temperature co-fired ceramic-based coils in probe heads for nuclear magnetic resonance spectrometry";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, M. Pieper;
E366,
2015;
Rigorosum: 14.10.2015.
A. Mazloum Nejadari:
"Fatigue Life Prediction of Micro Wire Bonds in Electronic Packages";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, G. Khatibi;
Institut für Sensor- und Aktuatorsysteme,
2019.
A. Mazloum-Nejadari:
"Fatigue Life Prediction of Micro Wire Bonds in Electronic Packages";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, R. Chabicovsky, H. Hieber, M. Nowottnick;
E366,
2019;
Rigorosum: 13.06.2019.
G. Miskovic:
"Analysis of pseudobrookite metal oxide semiconductor material with possible application for NO gas sensing";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, O. S. Aleksic;
E366,
2016;
Rigorosum: 21.12.2016.
M. Mündlein:
"Struktur und Eigenschaften isotrop leitfähiger Kleber";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, K.-J. Wolter;
Institut für Sensor- und Aktuatorsysteme,
2005.
L. Musiejovsky:
"Simulationsmethoden zur Untersuchung von thermischen Problemen im Packaging elektronischer Bauelemente";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics;
Institut für Industrielle Elektronik und Materialwissenschaften,
2001.
Zusätzliche Informationen
H. Schrottmayer:
"Experimentelle Untersuchung eines Verfahrens zur Qualitätssicherung beim Laserlöten";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics;
Institut für Werkstoffe der Elektrotechnik,
1997.
M. Unger:
"Temperature Stabilization and Modular Design Approach for Microfluidic Systems";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, P. Ertl, F. Keplinger;
E366,
2018;
Rigorosum: 17.12.2018.
M. Weilguni:
"Force Sensors for the Measurement of Finger Forces in Clarinet Playing";
Betreuer/in(nen), Begutachter/in(nen): J. Nicolics, W. Kausel;
E366,
2013;
Rigorosum: 12.06.2013.
Diplom- und Master-Arbeiten (eigene und betreute)
D. Akkale:
"Optimierung des Magnetfeldkreises eines magnetooptischen Schalters";
Betreuer/in(nen): M. Mündlein, J. Nicolics;
Institut für Sensor und Aktuatorsysteme,
2006;
Abschlussprüfung: 28.04.2006.
Zusätzliche Informationen
R. Enigl:
"Verfahren zur Messung der Wärmeübertragung durch freie Konvektion an elektronischen Bauelementen";
Betreuer/in(nen): G. Hanreich, J. Nicolics;
Institut für Industrielle Elektronik und Materialwissenschaften,
2000.
Zusätzliche Informationen
G. Hanreich:
"Thermische Charakterisierung von Halbleiterbauelementen mit Hilfe der Monte-Carlo-Simulation";
Betreuer/in(nen): J. Nicolics;
Institut für Werkstoffe der Elektrotechnik,
1998.
M. Hellein:
"Optimierung eines Siebdruckprozesses für Rohr- und Zylinderformteile mit Hilfe eines PC-gestützten Regelungssystems";
Betreuer/in(nen): J. Nicolics;
E366,
2011.
F. Heshmatpour:
"Ablaufanalyse und Schutzmaßnahmen von objektorientierter Individualsoftware zur thermischen Charakterisierung elektronischer Bauelemente";
Betreuer/in(nen): J. Nicolics, G. Hanreich;
Inst. f. Sensor- und Aktuatorsysteme,
2004.
Zusätzliche Informationen
W. Höftberger:
"Hochtemperaturlöten im Sensorpackaging";
Betreuer/in(nen): L. Musiejovsky, J. Nicolics;
Institut für Industrielle Elektronik und Materialwissenschaften,
2000.
Zusätzliche Informationen
M. Kogard:
"Qualitätskontrolle beim Laserlöten mit Lotpasten und Kompaktlotschichten";
Betreuer/in(nen): J. Nicolics, D. Schrottmayer;
Institut für Werkstoffe der Elektrotechnik,
1996.
H.G. Kranzl:
"Entwicklung und Aufbau eines ISA-Bus-Interfaces für einen Laser-Materialbearbeitungsplatz";
Betreuer/in(nen): J. Nicolics;
Institut für Werkstoffe der Elektrotechnik,
1999.
M. Mündlein:
"Entwicklung eines Kontaktierverfahrens für einen humanmedizinischen Hautfeuchtigkeitssensor";
Betreuer/in(nen): J. Nicolics, R. Chabicovsky, G. Hanreich;
Institut für. Industrielle Elektronik und Materialwissenschaften,
2000.
Zusätzliche Informationen
T. Oschee:
"Untersuchung der Selbstzentrierung von Area-array-Bauelementen beim Reflowlöten";
Betreuer/in(nen): J. Nicolics;
Institut für Werkstoffe der Elektrotechnik,
1997.
W. Rieder:
"Development and Implementation of EMC-Design Rules for a PCB Layout-CAD-Tool";
Betreuer/in(nen): J. Nicolics, W. Smetana;
Institut für Sensor- und Aktuatorsysteme,
2006;
Abschlussprüfung: 24.11.2006.
T. Thomschitz:
"Entwicklung eines Finite-Differenzen-Programms für die thermische Simulation von Laserlötprozessen";
Betreuer/in(nen): J. Nicolics;
Institut für Werkstoffe der Elektrotechnik,
1997.
M. Unger:
"Grundlegende Untersuchungen zur Realisierung eines Feuchtesensors in Low Temperature Co-fired Ceramic-Technologie";
Betreuer/in(nen): J. Nicolics, W. Smetana;
Institut für Sensor- und Aktuatorsysteme,
2006;
Abschlussprüfung: 12.10.2006.
D. Uschan:
"Electrical sliders in potentiometers for space application";
Betreuer/in(nen): J. Nicolics;
Institut für Sensor- und Aktuatorsysteme,
2012.
M. Weilguni:
"Development of a cancer cell imaging system";
Betreuer/in(nen): J. Nicolics;
Institut für Sensor- und Aktuatorsysteme,
2009;
Abschlussprüfung: 15.01.2009.
Wissenschaftliche Berichte
I. Atassi, J. Nicolics:
"Report - Vorstudie zur Anbindung thermoelektrischer Generatoren (TEG) auf gewölbten Flächen";
2011.
H. Hauser, J. Nicolics:
"Fertigungsmöglichkeiten von Magneto-Impedanz-Sensoren für die Sicherheitstechnik";
Bericht für Securiton Electronics, Wien;
1997.
H. Hauser, J. Nicolics:
"Möglichkeiten zum Lesen von magnetischem Bar-Code mittels Magneto-Impedanz-Effekt";
Bericht für Securiton Electronics, Wien;
1997.
H. Homolka, J. Nicolics, G. Radosavljevic:
"Analysis Report on Failure Cause of a Backlight - Converter - Unit";
2011.
R. Medek, J. Nicolics:
"Studie über Akkutechnologien für einspurige Elektro-Kraftfahrzeuge";
2011.
R. Medek, J. Nicolics:
"Untersuchung der Feuchtediffunsion in miniaturisierten Temperaturloggern für medizinische Anwendungen und Lebensdaueruntersuchungen an Lithiumbatterien";
2011.
J. Nicolics:
"Basisuntersuchungen für die Einsetzbarkeit anorganischer ätzmedien zum ätzen dicker AlSiMn-Schichten";
Bericht für Electrovac GmbH, Klosterneuburg;
1996.
J. Nicolics:
"Bericht über die Messung der Wärmeleitfähigkeit von Phosphoren-dotierten Polymeren für High-Power-LEDs";
Bericht für Tridonic Jennersdorf GmbH;
2010.
J. Nicolics:
"Bestimmung des dielektrischen Verhaltens von Lackisolationen auf Flach-Kupferdrähten";
Bericht für ASTA Elektrodraht GmbH & Co, A-2755 Oed Bezirk Wiener Neustadt;
2007;
11 S.
J. Nicolics:
"Charakterisierung, Herstellung und Trennung anisotrop leitfähiger Klebeverbindungen an Flüssigkristallbildschirmen";
Bericht für TAB Austria, Ansfelden;
1996.
J. Nicolics:
"Experimentelle Studie des Kontaktwiderstandes von passivierten Aluminiumteilen";
2011.
J. Nicolics:
"Joining Techniques and Application";
Bericht für TARGET Workshop "Electronic Packaging", Online Tutorial;
2007;
32 S.
J. Nicolics:
"Messung des Kontaktwiderstandes von passivierten Aluminiumteilen";
Bericht für Collini Wien GmbH;
2009;
3 S.
J. Nicolics:
"Metallographische Untersuchung von Lötverbindungen an AlSiC-Modulen";
Bericht für Electrovac AG, Aufeldgasse 37-39, A-3400 Klosterneuburg;
2006;
26 S.
J. Nicolics:
"Overview of Circuit Manufacturing: Printed Circuit-, Thin Film-, and Thick Film Technology";
Bericht für TARGET Workshop "Electronic Packaging", Online Tutorial;
2007;
50 S.
J. Nicolics:
"Simulation des thermischen Verhaltens von Multilayern mit integrierten optischen Bauelementen";
Bericht für AT&S Austria Technologie und Systeme, A-8700 Leoben-Hinterberg;
2005;
31 S.
J. Nicolics:
"Temperature dependent Misalignment of Optical Axis in Orthoferrite Crystals and Temperature Compensation";
Bericht für ETeCH, CH-8952 Schlieren;
2005;
6 S.
J. Nicolics:
"Thermal Management";
Bericht für Workshop "Electronic Packaging", Online Tutorial;
2007;
39 S.
J. Nicolics:
"Thermische Charakterisierung von Multilayern mit integrierten Wärmequellen - Projektstufe II";
Bericht für AT&S Austria Technologie und Systeme, A-8700 Leoben-Hinterberg;
2005;
73 S.
J. Nicolics:
"Thermographische Bestimmung des Emissionsgrades von metallisierten Kunststoff-Folien";
Bericht für Ioanneum Research, Weiz;
2010.
J. Nicolics:
"Umsetzung eines biokompatiblen Packaging-Konzepts für ein in Zahnspangen integrierbares Temperaturmesssystem - Zusammenfassender Abschlussbericht";
Bericht für Speziallabor für Zahnspangen Dr. Gerald Grabner KEG, Mödling;
2006;
35 S.
J. Nicolics:
"Untersuchung der Nutzbarkeit der Infrarotstrahlungsemission während des Laserlötens von Fine-Pitch-Bauelementen";
Bericht für BuS Elektronik GmbH, Riesa und ALS GmbH., Wien;
1996.
Zusätzliche Informationen
J. Nicolics:
"Untersuchung der packaging-bedingten Dehnung eines Temperatursensors";
Bericht für E&E Elektronik GmbH Engerwitzdorf;
2010.
J. Nicolics:
"Untersuchung von thermischen Farbindikatoren für Power-LED-Anwendungen";
Bericht für AT&S Austria Technologie & Systemtechnik Klagenfurt Leiterplatten GmbH;
2010.
J. Nicolics:
"Untersuchung zur Sicherstellung der Langzeitzuverlässigkeit von Kontakten in Mikrofonkapseln";
Bericht für AKG acoustics GmbH, A-1230 Wien;
2007;
21 S.
J. Nicolics:
"Untersuchungen zur Zuverlässigkeit der Kontaktierung von Flüssigkristallanzeigen von Pedometer";
Bericht für SBC Buchsbaum GmbH, Wien;
2007;
8 S.
J. Nicolics:
"Vergleichende Untersuchung der thermischen Performance von High-Power-LED-Baugruppen";
Bericht für AT&S Austria Technologie & Systemtechnik Klagenfurt Leiterplatten GmbH;
2010.
J. Nicolics:
"Verhalten von Heizbändern, eingesetzt in Kochmulden";
Bericht für Electrovac GmbH, A-3400 Klosterneuburg;
2005;
24 S.
J. Nicolics:
"Voruntersuchungen zum Bestücken einer Powermatrix - Teil I: Laserlöten";
Bericht für ESCATEC Switzerland AG;
2006;
9 S.
