Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
H. Schrottmayer, J. Nicolics:
"A New Experimental Method for Direct Determination of the Dynamic Wetting Behavior of SMDs";
Vortrag: International Spring Seminar on Electronics Technology (ISSE),
Szklarska Poreba;
05.07.1997; in: "Proceedings of 20th Int. Spring Seminar on Electronics Technology (ISSE 97)",
(1997),
S. 229
- 235.
Kurzfassung englisch:
The reliability of electronic devices is mainly influenced by the solder joint quality. However, state-of-the-art methods of solderability assessment are hardly suitable for SMDs. Recently, a new method of characterization of wettability has been introduced allowing to describe the cumulative effect of material properties and surface qualities of metallizations, solder and flux on the wetting behavior. This characterization is based on the detection of pairs of wetting temperatures and wetting delay times, respectively, obtained from experiments with different heating rates. From such results two temperature independent wetting parameters can be derived. Target of this paper is, firstly, to present a new measuring method for establishing these wetting parameters and, secondly, to discuss the very first results obtained from wettability measurements at different metallization systems as used in electronic packaging.
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.