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H. Schrottmayer, L. Musiejovsky, J. Nicolics:
"A New Method for Measuring the Dynamic Wettability under Dip and Wave Soldering Conditions";
Vortrag: International Spring Seminar on Electronics Technology (ISSE), Neusiedl am See, Austria; 04.05.1998 - 07.05.1998; in: "Proc. of 21st International Spring Seminar on Electronics Technology (ISSE 98)", Werkstoffe der Elektrotechnik, Wien (1998), ISBN: 3-85465-004-3; S. 249.

Solder joint quality is strongly related to the wettability of the mating metallizations of component and pad. State-of-the-art solderability assessment is based on wetting force measurement with a wetting balance. However, these results do not allow to determine the dynamic wettability, since the wetting time strongly depends on thermal qualities of the sample.
In this paper the wetting behavior of metal surfaces as commonly used for the attachment by dip soldering is studied based on a previously introduced new definition of wettability. Herein the dynamic wettability is expressed by two experimentally determined temperature independent surface parameters. This method is applied to different types of solders. The results of these measurements are presented and compared to results of wetting force measurements. It is demonstrated that with this method the influence of component’s age and storage conditions on the dynamic wetting behavior can be assessed accurately. The experimental set-up as well as the principle of calculation of wetting parameters are described.