Talks and Poster Presentations (with Proceedings-Entry):
R. Reicher, W. Smetana, J. Schuster, A. Adlaßnig:
"A TiCuAg Thick Film Composition for the Metallization of Aluminium Nitride Ceramic";
Poster: XXII IMAPS-Poland Conference,
Zakopane, Poland;
10-01-1998
- 10-03-1998; in: "Proceedings XXII. IMAPS-Poland Conference",
(1998),
299
- 302.
English abstract:
Actually, conductor pastes applied for metallization of aluminium nitride ceramic are glass bonding systems. The glass phase is responsible for adhesion onto the ceramic, unfortunately it also acts as a heat barrier and impairs the excellent thermal conductivity of aluminium nitride. A new glass frit free thick film metallization system has been developed. Aspects of paste preparation ranging from the derivation of the metallic powder to the assortment of an appropriate organic screen printing medium were investigated. Adhesion properties of the TiCuAg thick film metallization were tested by measuring tensile strength. Also numerical analysis of temperature and stress distribution within the metallized aluminium nitride ceramic has been carried out for this new metallization system by means of a finite element program.
Created from the Publication Database of the Vienna University of Technology.