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E. Hammel, C. Nagl, J. Nicolics, G. Hanreich:
"High Thermal Performance Silicon Heat Spreaders with Micro Whisker Structure";
Poster: 25th International Electronics Manufacturing Technology Symposium (IEMT 99), Austin, Texas; 18.10.1999 - 20.10.1999; in: "Proceedings 1999 IEMT Symposium", (1999), S. 426 - 432.

In-situ die attaching techniques for power electronics applications like laser diodes, microwave emitting diodes and microprocessors operated at high cycle rates frequently must allow loss power thermal qualities based on laser heating (using a 120 W rated Nd:YAG laser), surface temperature measurement (by thermovision and with miniaturized temperature sensors), and reverse modeling (using a new simulation tool for models with high-node numbers) is demonstrated. Results obtained from heat spreaders with microwhisker treatment are compared with those from reference samples with a polished surface. In this way it is found that the heat transfer coefficient can be improved by up to 100%. Based on these results prospectively possible applications and limitations for power electronics assemblies are derived.dissipation exceeding 100 W/cm2 at operation temperatures as low as possible. In this field new packaging concepts are required using substrates with enhanced thermal performance.