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Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):

E. Hammel, D. Holzer, G. Hanreich, J. Nicolics:
"Silicon Substrates with Microwhisker Structure";
Vortrag: 32nd Int. Symposium on Microelectronics (IMAPS 99), Chicago; 26.10.1999 - 28.10.1999; in: "Proc. of the 32nd Int. Symposium on Microelectronics", (1999), ISBN: 0-930815-58-0; S. 474 - 479.



Kurzfassung englisch:
Driving forces for developments in power electronics are the continuing miniaturization and enhancement of power densities. Especially for laser diodes and microwave emitting diodes conventional substrate and mounting techniques are frequently non-satisfying. In this field new packaging concepts are required allowing to dissipate loss power density levels more than 100 W/cm2 at operation temperatures as low as possible. However, the heat conduction from a substrate to a liquid cooling fluid (e.g. water) is limited by the LEIDENFROST phenomenon on exceeding a critical interface temperature. This effect is a barrier for further miniaturization. A promising attempt to improve the thermal transfer coefficient significantly is the development of silicon substrates structured with microwhiskers perpendicular to the surface. The whisker geometry can be varied widely by manufacturing parameters. However, an industrial application of this new heat spreader technology in power electronic modules makes necessary the specification of the substrate properties. In this work a new method for determination of thermal qualities based on laser heating of the heat spreader, surface temperature measurement by thermovision, and dynamic reverse modeling is described. Furthermore, the thermal behavior of heat spreaders with microwhisker treatment and of reference samples with a smooth surface is compared. Based on these results prospectively possible applications and limits of such heat spreaders for power electronics assemblies are derived.

Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.