Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
G. Hanreich, J. Nicolics, R. Fasching:
"Thermal Analysis of new Silicon-Based Substrates";
Poster: XVI IMEKO World Congress 2000,
Wien;
25.09.2000
- 28.09.2000; in: "Proceedings IMEKO 2000",
Vol. 2
(2000),
S. 355
- 359.
Kurzfassung englisch:
New packaging concepts are required for power electronic modules allowing to dissipate high loss power density levels at low operation temperatures. Best heat removal from a substrate is obtained using liquid coolants. However, in this way the heat transfer coefficient is limited by the Leidenfrost phenomenon. A promising attempt to improve the thermal transfer significantly is the development of silicon substrates structured with microwhiskers perpendicular to the surface. However, an industrial application of this new technology for heatspreaders in power electronic modules makes necessary the specification of the substrate properties. In this work a new method for determination of thermal qualities based on laser heating of the heatspreader, surface temperature measurement by thermovision, and dynamic reverse modelling is described. Based on these results prospectively possible applications and limits of such heatspreaders for power electronics assemblies are derived.
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.