Talks and Poster Presentations (with Proceedings-Entry):
W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Kyoto, Japan;
1999-09-06
- 1999-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(1999),
ISBN: 4-930813-98-0;
199
- 202.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.1999.799295
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2000/CP1999_Pyka_1.pdf
Created from the Publication Database of the Vienna University of Technology.