Talks and Poster Presentations (with Proceedings-Entry):
A. Hössinger, T. Binder, W. Pyka, S. Selberherr:
"Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Athens, Greece;
2001-09-05
- 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2001),
ISBN: 3-211-83708-6;
424
- 427.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1007/978-3-7091-6244-6_98
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2002/CP2001_Hoessinger_1.pdf
Created from the Publication Database of the Vienna University of Technology.