Talks and Poster Presentations (with Proceedings-Entry):
A. Hössinger, J. Cervenka, S. Selberherr:
"A Multistage Smoothing Algorithm for Coupling Cellular and Polygonal Datastructures";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Cambridge, MA, USA;
2003-09-03
- 2003-09-05; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2003),
ISBN: 0-7803-7826-1;
259
- 262.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2003.1233686
Online library catalogue of the TU Vienna:
http://aleph.ub.tuwien.ac.at/F?base=tuw01&func=find-c&ccl_term=AC04403723
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2004/CP2003_Hoessinger_1.pdf
Created from the Publication Database of the Vienna University of Technology.