Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, Ch. Hollauer, S. Selberherr:
"Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Monterey, CA, USA;
2006-09-06
- 2006-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2006),
ISBN: 1-4244-0404-5;
192
- 195.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2006.282869
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2007/CP2006_Ceric_1.pdf
Created from the Publication Database of the Vienna University of Technology.