[Zurück]

D. Esinenco, E Budianu, I. Bineva, D. Andrijasevic, E. Manea, W. Brenner, R. Müller:
"Integrated optical proximity microsensor";
Journal of Luminescence, 121 (2006), 2; S. 394 - 398.

This paper presents the design, simulation and experimental results of an integrated proximity sensor manufactured on silicon substrate. The sensor was designed for microrobotic applications like integration into a microgripper arm or detection of the position of gripper arms relative to an object. The structure is based on an SU8 polymeric optical waveguide splitted into three arms, integrated with a multielement photodetector on silicon substrate. Each element of the photodetector is a metal-semiconductor-metal (MSM) photodiode with Ti/Al Schottky interdigitated electrodes.

The operation principle of this sensor consists in the light coupling in the central arm of the optical waveguide, interaction with the object (reflection) of the radiation which exits from this principal arm, the coupling of the "affected" radiation which comes back through the end of the waveguide and its splitting into three arms of the optical waveguide. From the optical waveguide, the light is coupled in photodiode and the photogenerated carriers are collected to the electrodes giving the electrical signal which is read and processed in real time.

The optimal parameters of the waveguide (width, thicknesses of the core and the claddings) of the photodetector and the coupling between them were defined by simulation, using FDTD and BeamProp method (Opti FDTD software). Our microsensor can detect the position of an object in the range of 0-300 μm, as position sensor and with high precision in the range of zero to twice the wavelength, as proximity sensor.

http://dx.doi.org/10.1016/j.jlumin.2006.08.065

Projektleitung Werner Brenner:
Methoden und Werkzeuge für Handhabung und Montage in der Mikrodimension (Tech. abgeschlossen 2007)