[Zurück]

C. Eisenmenger-Sittner, C. Schrank, E. Neubauer, H. Bangert, A. Bergauer:
"SOLID STATE DE-WETTING OF VAPOR DEPOSITED FILMS ON PLANAR AND FIBER-SHAPED CARBON SUBSTRATES";
Vortrag: E-MRS Spring Meeting 2003, Strassbourg/Frankreich (eingeladen); 10.06.2003 - 13.06.2003.

In novel materials the interface zone between their components is a point of crucial importance in respect to mechanical or thermal contact. Copper-Carbon composites are an example for this material class. They have a potential for an application as heat sinks in electronic components, but joining the two materials is difficult.
Two critical processing steps determine the interfacial properties: first the deposition of Cu on the C surface at room temperature and second the heat treatment of the material during the compactation process. In this paper we investigate the adhesive properties of Cu-films on planar C-substrates and the de-wetting of Cu from C during heat treatment. De-wetting occurs well below the melting point of copper. It starts with hole formation and ends with the decomposition of the Cu-Film into isolated droplets. A similar behavior is observed on Carbon-fibers.
The above issues (interfacial adhesion and de-wetting) are investigated in dependence on several pre-treatment processes which were applied to the C-surface such as plasma-modification or the deposition of intermediate layers. The basic mechanisms of adhesion promotion and de-wetting are identified and the consequences of the experimental findings for the manufacturing of Cu-C composite materials are briefly discussed.

This Work is Supported by the Austrian FWF, Grant #P14534.