Vorträge und Posterpräsentationen (ohne Tagungsband-Eintrag):
E. Neubauer, G. Korb, C. Eisenmenger-Sittner, H. Bangert:
"Interface Optimisation in the Copper-Carbon System";
Vortrag: DIS´03 - International Workshop on Designing of Interfacial Structures in Advanced Materials and their Joints,
Wien, Österreich;
13.07.2003
- 16.07.2003.
Kurzfassung englisch:
Interface Optimisation in the Copper-Carbon System
Erich Neubauer*/**, Georg Korb*, Christoph Eisenmenger-Sittner**, Herwig Bangert**
* Dept. Materials & Production Engineering, ARC Seibersdorf Research, A-2444 Seibersdorf
** Institut für Festkörperphysik, Technische Universität Wien, A-1040 Wien
Copper carbon composites are an attractive material for application as heat sinks for high power electronics. One of the main drawbacks of this material system is the lack of adhesion and wetting between the copper matrix and the carbon fiber. To overcome this problem the basics of adhesion and wetting were studied on a model substrate (plane carbon substrate). In order to improve the wetting behaviour as well as the adhesion, vacuum deposition methods (sputter deposition) were used instead of electrochemical coating techniques. By choosing this method and by the deposition of intermediate layers of Ti or Cr the adhesion strength of the copper coating was improved in the as deposited stage as well as after a heat treatment.
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.