[Zurück]

C. Schrank, B. Schwarz, C. Eisenmenger-Sittner, K. Mayerhofer, E. Neubauer:
"INFLUENCE OF THERMAL TREATMENT ON THE ADHESION OF COPPER COATINGS ON CARBON SUBSTRATES";
Poster: Joint Vacuum Conference 10, JVC-10, Portoroz, Slovenien; 28.09.2004 - 02.10.2004.

Sputter deposited Copper (Cu) coatings on plane glassy Carbon (C) substrates serve as a model for the interface between Cu and C-fibers in Cu-C Metal Matrix Composites (MMC's). This interface is of crucial importance for the mechanical and thermal properties of Copper Carbon MMC's.
If the Cu-coating is deposited on a Nitrogen-RF-Plasma treated C-substrate at room temperature (RT), the adhesion of Cu to C is excellent. In a further step the Cu-coated C-samples are subjected to a thermal treatment at 800°C under high vacuum conditions for 1 hour to partially mimic the hot pressing step involved in the production of real MMC's. This thermal treatment generates a recrystallisation induced de-wetting process of the Cu coating from the C substrate, which drastically reduces the adhesion of Cu to C.
If a molybdenum-intermediate layer is deposited, no dewetting of the Cu-film takes place, although recrystallisation occurs. Additionally the adhesion of the Cu-film is, depending on a minimum thickness of the the molybdenum layer, low in the as deposited state and is strongly increased after the annealing step. SIMS-measurements indicate that this increase is caused by the formation of molybdenum-carbides during the heat treatment.
This work is supported by the Austrian Science Fund (FWF) under grant Nr. P-14534.