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S. Groth, P. Krüger, S. Wildermuth, R. Folman, T. Fernholz, Jörg Schmiedmayer, D. Mahalu, I. Bar-Joseph:
"Atom chips: Fabrication and thermal properties";
Applied Physics Letters, 85 (2004), 14; 2980 - 2982.

Neutral atoms can be trapped and manipulated with surface mounted microscopic current carrying and charged structures. We present a lithographic fabrication process for such atom chips based on
evaporated metal films. The size limit of this process is below 1 µm. At room temperature, thin wires can carry current densities of more than 107 A/cm2 and voltages of more than 500 V. Extensive test measurements for different substrates and metal thicknesses (up to 5 µm) are compared to models for the heating characteristics of the microscopic wires. Among the materials tested, we find that Si is the best suited substrate for atom chips.

http://aleph.ub.tuwien.ac.at/F?base=tuw01&func=find-c&ccl_term=AC06588223