Talks and Poster Presentations (with Proceedings-Entry):
W. Elmenreich, S. V. Krywult:
"A Comparison of Fieldbus Protocols: LIN 1.3, LIN 2.0, and TTP/A";
- 2005-09-22; in: "Proceedings of the 10th IEEE Internationla Conference on Emerging Technologies and Factory Automation",
S. V. Krywult (ed.);
This paper compares the fieldbus protocols LIN 1.3, LIN 2.0, and TTP/A to the requirements of low-cost body electronic networks in the automotive domain. The examined protocols all aim at distributed smart sensor/actuator networks and provide support for low-cost implementation on standard microcontroller nodes.
LIN comes with a rigid specification of the physical layer in order to support interoperability between LIN nodes of different vendors. The LIN specification defines also a complete application framework supporting developing and configuring LIN networks.
The TTP/A specification describes a pure communication system and leaves a lot of decisions regarding physical layer, fault detection, redundancy, etc. to the system designer. The time-triggered scheduling of messages leads to a very high data efficiency, even for short messages.
Online library catalogue of the TU Vienna:
Created from the Publication Database of the Vienna University of Technology.