Contributions to Proceedings:
R. Heuer, C. Adam, F. Ziegler:
"Thermally stressed sandwich panels with interlayer slip";
in: "Proceedings of 5. Int. Congress on Thermal Stresses and Related Topics",
L. Librescu, P. Marzocca (ed.);
issued by: Virginia Tech;
International Congress on Thermal Stresses,
Blacksburg, Virginia, USA,
Thermally induced plane bending of sandwich panels composed of three symmetrically arranged layers are studied under the consideration of plane strain. Analyzing two special cases of interlaminar connections, i.e., "perfect bond" and "elastic interlayer slip", a complete analogy between the corresponding initial-boundary value problems is derived. Hence, the response of the panel with elastic interlayer slip can be determined directly from the solution of the perfectly bonded sandwich panel with moderately thick faces by substituting effective parameters.
Online library catalogue of the TU Vienna:
Created from the Publication Database of the Vienna University of Technology.