Vorträge und Posterpräsentationen (ohne Tagungsband-Eintrag):
R. Heuer:
"Thermally stressed sandwich structures with interlayer slip";
Vortrag: 5. Int. Congress on Thermal Stresses and Related Topics,
Blacksburg, Virginia, USA;
08.06.2003
- 11.06.2003.
Kurzfassung englisch:
Thermally induced plane bending of sandwich panels composed of three symmetrically arranged layers are studied under the consideration of plane strain. Analyzing two special cases of interlaminar connections, i.e., "perfect bond" and "elastic interlayer slip", a complete analogy between the corresponding initial-boundary value problems is derived. Hence, the response of the panel with elastic interlayer slip can be determined directly from the solution of the perfectly bonded sandwich panel with moderately thick faces by substituting effective parameters.
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.