Talks and Poster Presentations (without Proceedings-Entry):
R. Heuer:
"Thermally stressed sandwich structures with interlayer slip";
Talk: 5. Int. Congress on Thermal Stresses and Related Topics,
Blacksburg, Virginia, USA;
2003-06-08
- 2003-06-11.
English abstract:
Thermally induced plane bending of sandwich panels composed of three symmetrically arranged layers are studied under the consideration of plane strain. Analyzing two special cases of interlaminar connections, i.e., "perfect bond" and "elastic interlayer slip", a complete analogy between the corresponding initial-boundary value problems is derived. Hence, the response of the panel with elastic interlayer slip can be determined directly from the solution of the perfectly bonded sandwich panel with moderately thick faces by substituting effective parameters.
Created from the Publication Database of the Vienna University of Technology.