Talks and Poster Presentations (with Proceedings-Entry):

E. Neubauer, I. Smid, G. Requena, H.P. Degischer, P. Angerer:
"Thermophysical Properties of Copper Composites Reinforced with Negative CTE fillers";
Talk: Proceedings of the 2006 International Conference On Powder Metallurgy & Particulate Materials, San Diego/ California/ USA; 2006-06-18 - 2006-06-21; in: "Proceedings of the 2006 International Conference On Powder Metallurgy & Particulate Materials", http://www.mpif.org/Pubs/2006conts.asp?linkid=87, (2006), ISBN: 0-9762057-6-9; 9-37 - 9-43.

English abstract:
Copper reinforced with low Coefficient of Thermal Expansion (CTE) fillers such as carbon fibers or SiC particles have been investigated for several years. Such a material combines a high thermal conductivity with a low CTE. This work reports on first results which have been achieved by combining a copper matrix with a filler material exhibiting a negative CTE by using rapid sintering with the goal to reduce the resulting overall CTE but keeping a high thermal conductivity at a relatively low amount of filler. The used filler material is characterized by a negative CTE value in the range of -8 to -10 ppm/K.
By using a powder metallurgical approach whereby mixing Cu with the negative filler a composite with tailorable CTE can be prepared. The produced composites have been investigated with respect to their thermal expansion behavior. A promising material with a CTE in the range of 8 to 12 ppm/K at room temperature and still acceptable thermal conductivity has been obtained.

Created from the Publication Database of the Vienna University of Technology.