Publications in Scientific Journals:
R. Orio, H. Ceric, S. Selberherr:
"Effect of Strains on Anisotropic Material Transport in Copper Interconnect Structures under Electromigration Stress";
Journal of Computational Electronics,
7
(2008),
3;
128
- 131.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1007/s10825-008-0211-9
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2008/JB2008_Orio_1.pdf
Created from the Publication Database of the Vienna University of Technology.