Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, R. Orio, J. Cervenka, S. Selberherr:
"Analysis of Microstructure Impact on Electromigration";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
Hakone, Japan;
2008-09-09
- 2008-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2008),
ISBN: 978-1-4244-1753-7;
241
- 244.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2008.4648282
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2009/CP2008_Ceric_1.pdf
Created from the Publication Database of the Vienna University of Technology.