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M. Trinker, S. Groth, S. Haslinger, S. Manz, Th. Betz, S. Schneider, I. Bar-Joseph, Thorsten Schumm, H.-J. Schmiedmayer:
"Multilayer atom chips for versatile atom micromanipulation";
Applied Physics Letters, 92 (2008), 254102; S. 1 - 3.

We employ a combination of optical and electron-beam lithography to create an atom chip combining submicron wire structures with larger conventional wires on a single substrate. The multilayer fabrication enables crossed wire configurations, greatly enhancing the flexibility in designing potentials for ultracold quantum gases and Bose-Einstein condensates. Large current densities of >6x10⁷ A/cm² and high voltages of up to 65 V across 0,3 μm gaps are supported by even the smallest wire structures. We experimentally demonstrate the flexibility of the next generation atom chip by producing bose-Einstein condensates in magnetic traps created by a combination of wires involving all different fabrication methods and structure sizes.

http://dx.doi.org/10.1063/1.2945893

http://publik.tuwien.ac.at/files/PubDat_167985.pdf