Vorträge und Posterpräsentationen (ohne Tagungsband-Eintrag):
M. Schöbel, G. Requena, H.P. Degischer, T. Buslaps, M. di Michiel:
"Residual stresses and void kinetics in particle reinforced metal matrix composites during thermal cycling";
Poster: ESRF user meeting,
Grenoble;
05.02.2008
- 07.02.2008.
Kurzfassung englisch:
Base plate Materials with a high thermal conductivity and a low CTE are needed for power electronic devices like IGBTs (Insulated Gate Bipolar Transistor). High power densities generates heat which has to be transported away from the electronics by a material with a high TC. Debonding between the insulator and the base plate caused by thermal expansion mismatch has to be reduced by a low CTE of the base plate material.
Schlagworte:
MMC, heat sink, synchrotron, diffraction, tomography
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.