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Publications in Scientific Journals:

H. Ceric, R. Orio, J. Cervenka, S. Selberherr:
"A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects";
IEEE Transactions on Device and Materials Reliability, 9 (2009), 1; 9 - 19.



"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/TDMR.2008.2000893

Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2009/JB2009_Ceric_1.pdf


Created from the Publication Database of the Vienna University of Technology.