Publications in Scientific Journals:
H. Ceric, R. Orio, J. Cervenka, S. Selberherr:
"A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects";
IEEE Transactions on Device and Materials Reliability,
9
(2009),
1;
9
- 19.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/TDMR.2008.2000893
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2009/JB2009_Ceric_1.pdf
Created from the Publication Database of the Vienna University of Technology.