Talks and Poster Presentations (without Proceedings-Entry):
A. Jüngel:
"Numerical simulations of a coupled thermal circuitsemiconductor device model";
Talk: Seminar Numerische Mathematik an der Technischen Universität Kaiserslautern, Deutschland,
Kaiserslautern (invited);
2009-04-08.
English abstract:
A coupled semiconductor-circuit model
including thermal effects is proposed. The semiconductor
device is modeled by the energy-transport
equations, and the electric circuit is described by
the network equations from modified nodal analysis.
The resulting system of nonlinear partial differential-algebraic
equations is solved using mixed finite elements
in space and the BDF2 method in time. Numerical
results for a frequency multiplier and a clipper circuit
illustrate the thermal effects present in the system.
German abstract:
Siehe englisches Abstract.
Keywords:
Semiconductors; finite-element method; thermal effects
Created from the Publication Database of the Vienna University of Technology.