Talks and Poster Presentations (with Proceedings-Entry):
H. Ceric, R. Orio, J. Cervenka, S. Selberherr:
"Copper Microstructure Impact on Evolution of Electromigration Induced Voids";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD),
San Diego, CA, USA;
2009-09-09
- 2009-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)",
(2009),
ISBN: 978-1-4244-3947-8;
178
- 181.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/SISPAD.2009.5290222
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2009/CP2009_Ceric_2.pdf
Created from the Publication Database of the Vienna University of Technology.