Publications in Scientific Journals:
R. Huang, W. Robl, H. Ceric, T. Detzel, G. Dehm:
"Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing";
IEEE Transactions on Device and Materials Reliability,
10
(2010),
1;
47
- 54.
"Official" electronic version of the publication (accessed through its Digital Object Identifier - DOI)
http://dx.doi.org/10.1109/TDMR.2009.2032768
Electronic version of the publication:
http://www.iue.tuwien.ac.at/pdf/ib_2009/JB2010_Huang_1.pdf
Created from the Publication Database of the Vienna University of Technology.