Talks and Poster Presentations (with Proceedings-Entry):
J. Gager, B. Karunamurthy, M. Nelhiebel, H. E. Pettermann:
"Finite Element Based Simulations of Interface Cracks in Semiconductor Devices - A Study on Geometry Parameters and Delamination Configurations";
Talk: 18th European Conference on Fracture,
Dresden;
08-30-2010
- 09-03-2010; in: "Fracture of Materials and Structures form Micro to Macro Scales",
ESIS,
(2010),
Paper ID 233,
8 pages.
English abstract:
Fracture mechanics studies on interface cracks in a glued die-attach chip package system are investigated using the finite element method. The residual stress state arising from the fabrication process is considered and a uniform temperature load is applied. A linear elastic fracture mechanics approach is taken using the displacement extrapolation method and the virtual crack closure technique. Different interface cracks are modelled and the crack tip parameters (i.e. stress intensity factors and mode mix) are computed with respect to the variation of crucial geometry parameters. A strong influence of the bleed-out shape and the distance between lead frame edge and bleed-out corner on the crack tip parameters of the interface crack tips is shown.
Created from the Publication Database of the Vienna University of Technology.