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A. Stehle, G. Georgiev, V. Ziegler, B. Schönlinner, U. Prechtel, H. Seidel, U. Schmid:
"Glass Cap Packaged High Isolating Ka-Band RF-MEMS Switch";
Plus, 3 (2009), 638 - 641.

This paper presents a packaged high-isolation
RF-MEMS switch at Ka-band. The package consists
of a glass cap with a milled cavity to protect the
RF-MEMS. The glass cap, with a low dielectric
constant, is bonded to the silicon substrate using
ultraviolet light curable glue in a room temperature
process. The packaging is 11011 hermetic but able to
withstand 'water alld dust for a limited time period.
The switch shows all isolation of 50 dB and an insertion
loss of 0.8 dB at 30 GHz. The additional loss
due to the package was found to be only 0.1 dB.